Polyimide film material capable of serving as flexible transparent conducting film substrate and preparation method thereof

A technology of transparent conductive film and polyimide film, which is applied to the conductive layer on the insulating carrier and other directions, can solve the problems of UV resistance, high moisture absorption rate, and inability to meet high temperature processing technology, so as to increase transparency and reduce moisture absorption. performance, excellent optical performance

Inactive Publication Date: 2011-06-15
UNIV OF SCI & TECH LIAONING
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Among the currently available materials, there are polyester (PET), polycarbonate (PC), etc., but they are limited because they are not resistant to ultraviolet rays,

Method used

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  • Polyimide film material capable of serving as flexible transparent conducting film substrate and preparation method thereof
  • Polyimide film material capable of serving as flexible transparent conducting film substrate and preparation method thereof
  • Polyimide film material capable of serving as flexible transparent conducting film substrate and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032]In a three-necked reaction flask equipped with a stirrer, a thermometer and a nitrogen inlet, 6.5445 g of 2,2-bis[4-(4-amino-2-trifluoromethylphenoxy)phenyl]hexafluoropropane (0.01mol) was dissolved in 51.38ml of DMAc solvent, stirred to make the solution clear and transparent. Then, 1.9611 g (0.01 mol) of 1,2,3,4-cyclobutanetetracarboxylic dianhydride (CBDA) was added to the solution at one time, stirred to dissolve it completely, and continued to react for 15 to 25 minutes under a nitrogen protection environment. Hours, the obtained transparent viscous liquid is polyamic acid, a precursor of polyimide that can be used as a flexible transparent conductive film substrate, with a solid content of 15 wt % and an intrinsic viscosity of 1.25 dL / g. Coat the polyamic acid solution on a clean glass plate, place it in a drying oven with nitrogen protection, and heat up according to the following program: 80°C for 2hrs, 120°C for 1hr, 150°C for 1hr, 200°C for 1hr, and 250°C 1hr,...

Embodiment 2

[0035] In a three-necked reaction flask equipped with a stirrer, a thermometer and a nitrogen inlet, 6.5445 g of 2,2-bis[4-(4-amino-2-trifluoromethylphenoxy)phenyl]hexafluoropropane (0.01mol) was dissolved in 52.23ml of DMAc solvent, stirred to make the solution clear and transparent. Then add 2.1014g (0.01mol) of 1,2,4,5-cyclopentanetetracarboxylic dianhydride (CPDA) to the solution at one time, stir to dissolve it completely, and continue the reaction for 15 to 25 minutes under nitrogen protection. Hours, the obtained transparent viscous liquid is polyamic acid, a precursor of polyimide that can be used as a flexible transparent conductive film substrate, with a solid content of 15 wt % and an intrinsic viscosity of 1.06 dL / g. Coat the polyamic acid solution on a clean glass plate, place it in a drying oven with nitrogen protection, and heat up according to the following program: 80°C for 2hrs, 120°C for 1hr, 150°C for 1hr, 200°C for 1hr, and 250°C 1hr, 0.5hr at 300°C. Aft...

example 3

[0038] In a three-necked reaction flask equipped with a stirrer, a thermometer and a nitrogen inlet, 6.5445 g of 2,2-bis[4-(4-amino-2-trifluoromethylphenoxy)phenyl]hexafluoropropane (0.01mol) was dissolved in 53.08ml of DMAc solvent, stirred to make the solution clear and transparent. Then, 2.2417 g (0.01 mol) of 1,2,4,5-cyclohexanetetracarboxylic dianhydride (CHDA) was added to the solution at one time, stirred to dissolve it completely, and continued to react for 15 to 25 minutes under a nitrogen protection environment. Hours, the obtained transparent viscous liquid is polyamic acid, a precursor of polyimide that can be used as a flexible transparent conductive film substrate, with a solid content of 15 wt % and an intrinsic viscosity of 1.00 dL / g. Coat the polyamic acid solution on a clean glass plate, place it in a drying oven with nitrogen protection, and heat up according to the following program: 80°C for 2hrs, 120°C for 1hr, 150°C for 1hr, 200°C for 1hr, and 250°C 1hr...

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Abstract

The invention relates to a polyimide film material capable of serving as a flexible transparent conducting film substrate and a preparation method thereof. Polyimide is obtained by undergoing a low-temperature solution condensation reaction between alicyclic dianhydride and fluorine diphenyl ether-containing aromatic diamine, and aminating hot imide. The polyimide film material has the glass-transition temperature between 250 DEG C and 300 DEG C, a very light film color, the ultraviolet cutoff wavelength between 280 nanometers and 330 nanometers, high transparency in a visible light region (between 400 nanometers and 700 nanometers), the light transmission rate of over 90 percent at the position of 450 nanometers and high machining performance, so that the film material can be taken as a substrate material of a flexible transparent conducting film.

Description

technical field [0001] The invention relates to a polyimide film material which can be used as a flexible transparent conductive film substrate and a preparation method thereof. Background technique [0002] The polyimide (polyimides, PI) of the present invention is a kind of polyimide obtained by alicyclic dianhydride and fluorine-containing phenylene ether type aromatic diamine monomer through low-temperature solution polycondensation reaction and thermal imidization , the polyimide has the characteristics of high temperature resistance and colorless transparency, and can be used as a flexible transparent conductive film substrate material, and the flexible transparent conductive film material can be used in solar cells, flat panel displays, thin film transistors (TFT), gas sensor , antistatic coatings and semiconductor / insulator / semiconductor (SIS) heterojunctions, windows of modern fighters and cruise missiles and other high-tech fields, so the polyimide has a special ap...

Claims

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Application Information

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IPC IPC(8): C08G73/10C08J5/18H01B5/14
Inventor 鲁云华胡知之王永飞肖国勇迟海军赵洪斌董岩
Owner UNIV OF SCI & TECH LIAONING
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