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Evaluation method

A capillary and structural technology, applied in the field of performance of metal powder, can solve the problems of long manufacturing process, many equipment, different design ideas, etc., and achieve the effect of fast testing process, saving analysis time, and simple testing process.

Inactive Publication Date: 2012-08-22
SCM METAL PROD SUZHOU
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  • Description
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Problems solved by technology

Due to the complex process of actually manufacturing the heat pipe, the long manufacturing process and the large amount of equipment required, this evaluation method has a high cost and a long cycle, and is easily interfered by other factors (such as vacuum degree, flattening and bending), so it cannot Accurately reflect the performance of the powder
[0005] Taiwanese scholars (master's thesis, author: Wang Yongchuan, thesis title: heat flow characteristics of sintered capillary structure in heat pipe, 2006) used hydrostatic pressure experiment to measure the permeability of copper powder sintered body, but this test method is under the condition of water pressure. It is carried out under certain conditions, which cannot reflect the size of the capillary force inside the sintered body, and cannot truly reflect the performance of the copper powder in the heat pipe.
[0006] Chinese patent 200820142394.4 also proposes a towel water absorption tester to characterize the capillary water absorption capacity and water retention capacity of the towel, but it is only for textiles and does not mention metal powder, and it is different from the design idea of ​​the present invention, so it is not suitable for use Evaluation of the in-service performance of metal powders used in the manufacture of capillary layers for heat pipes

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Embodiment Construction

[0029] The preferred embodiments of the present invention will be described in detail below. However, those skilled in the art can understand that the present invention is not limited to specific embodiments.

[0030] A method for evaluating the performance of the metal powder used to manufacture the capillary structure layer of a heat pipe. The specific operation steps are as follows:

[0031] Preparation of capillary structure

[0032] Fill the metal powder into the mold by vibration. The cavity of the mold has a regular shape (such as a cylinder and a rectangular parallelepiped. The following description will take a cylinder as an example). The powder in the cavity of the mold is required to be compact and filled. That is, the height of the powder does not decrease with the prolongation of the vibration time. After filling, use a ruler to scrape off the excess powder outside the cavity of the mold. Use the same sintering process (including sintering atmosphere and sintering tem...

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Abstract

The invention provides a method for evaluating the usability of metal powder for manufacturing a capillary structure layer of a heat pipe, which comprises the following steps of: (1), preparing a capillary structure; (2), testing water absorbing performance; and (3), calculating water absorbing flux of a capillary force. The water absorbing flux of the capillary force is a key parameter affectingheat transfer efficiency of the heat pipe, wherein a greater numerical value indicates higher heat transfer efficiency of the heat pipe; therefore, the water absorbing flux of the capillary force canbe used for evaluating the usability of the metal powder for manufacturing the heat pipe. The evaluation method of the invention simplifies the evaluation process of the metal powder used for manufacturing the heat pipe and can provide reliable evidences for determining the manufacturing process parameters of the heat pipe. Meanwhile, the evaluation method provided by the invention can be also applied to represent the property of a capillary structure material including moving fluid and therefore has a bright application prospect in the field of material manufacturing.

Description

Technical field [0001] The invention relates to a method for evaluating the use performance of metal powder for manufacturing a capillary structure layer of a heat pipe, and belongs to the field of material performance evaluation. Background technique [0002] With the intelligentization and integration of electronic and electrical components, the speed and functions of high-end electronic system products that emphasize computing speed and stability, such as servers and workstations, PCs and notebook computers, are also increasing, which has led to the integration of CPUs and others. Microcircuits have increasingly higher performance and computing requirements. However, in this development trend, one of the biggest obstacles comes from heat generation. The heat is mainly generated by the chip in the process of calculation. As the integration of the chip increases, the heat generation is greater. With the generation of hundreds of watts of high heat, traditional heat dissipation...

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01N5/00G01N15/00
Inventor 胡立荣莫文剑唐波王汉宁翁海龙易翠
Owner SCM METAL PROD SUZHOU