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Processing method of chemical mechanical polishing (CMP) waste liquid

A technology of chemical machinery and treatment methods, applied in the direction of oxidation water/sewage treatment, flocculation/sedimentation water/sewage treatment, etc., can solve the problem of high concentration and usage of coagulants and oxidants, unstable discharge water quality, and low treatment efficiency Low-level problems, easy to obtain, mild and stable physical and chemical properties, and environmentally friendly effects

Inactive Publication Date: 2014-09-24
ANJI MICROELECTRONICS (SHANGHAI) CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0019] The technical problem to be solved by the present invention is to overcome the high concentration and amount of coagulants and oxidants used in the existing treatment methods of chemical mechanical grinding waste liquid, and the low treatment efficiency , difficult to control, high cost, unstable discharge water quality and other defects, a treatment method for chemical mechanical grinding waste liquid is provided, which can effectively reduce the amount of coagulant and oxidant in the chemical mechanical grinding waste liquid COD value, improve oxidation efficiency, reduce the treatment cost of chemical mechanical grinding waste liquid

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0041] 1. Configure coagulant solution:

[0042] 1) 30 grams of high-efficiency composite coagulant polyaluminum ferric sulfate and 70 grams of deionized water are prepared to prepare 100 grams of high-efficiency composite coagulant solution with a concentration of 30%.

[0043] 2) 1 gram of organic polymer coagulant polyacrylamide non-ionic and 99 grams of deionized water to prepare 100 grams of organic polymer coagulant solution with a concentration of 1%.

[0044] 2. Configure the oxidizing agent solution: 10 grams of oxidizing agent sodium hypochlorite and 90 grams of deionized water are prepared into 100 grams of oxidizing agent solution with a concentration of 10%.

[0045] 3. Treatment of chemical mechanical grinding waste liquid:

[0046] 1) Add 10 grams of the above-mentioned high-efficiency composite coagulant solution to 50 ml of chemical mechanical grinding waste liquid, adjust the pH to 8 with 30% sodium hydroxide solution, stir for 2 minutes, and then add 10 grams...

Embodiment 2

[0052] 1. Configure coagulant solution:

[0053] 1) 30 grams of high-efficiency composite coagulant polyaluminum ferric chloride and 70 grams of deionized water are prepared to prepare 100 grams of high-efficiency composite coagulant solution with a concentration of 30%.

[0054] 2) 1 gram of organic polymer coagulant polyacrylamide non-ionic and 99 grams of deionized water to prepare 100 grams of organic polymer coagulant solution with a concentration of 1%.

[0055] 2. Configure oxidizing agent solution: 10 grams of oxidizing agent calcium hypochlorite and 90 grams of deionized water are prepared into 100 grams of oxidizing agent solution with a concentration of 10%.

[0056] 3. Treatment of chemical mechanical grinding waste liquid:

[0057] 1) Add 10 grams of the above-mentioned high-efficiency composite coagulant solution to 50 ml of chemical mechanical grinding waste liquid, adjust the pH to 8 with 30% sodium hydroxide solution, stir for 2 minutes, and then add 10 grams...

Embodiment 3

[0063] 1. Configure coagulant solution:

[0064] 1) 40 grams of high-efficiency composite coagulant polyaluminum iron silicate and 60 grams of deionized water are prepared into 100 grams of high-efficiency composite coagulant solution with a concentration of 40%.

[0065] 2) 0.5 gram of organic polymer coagulant sodium polyacrylate and 99.5 gram of deionized water are prepared into 100 grams of organic polymer coagulant solution with a concentration of 0.5%.

[0066] Two, configure the oxidizing agent solution: 5 grams of oxidizing agent chlorine dioxide and 95 grams of deionized water are prepared into 100 grams of oxidizing agent solution with a concentration of 5%.

[0067] 3. Treatment of chemical mechanical grinding waste liquid:

[0068] 1) Add 5 grams (0.04 g / ml) of the above-mentioned high-efficiency composite coagulant solution to 50 ml of chemical mechanical grinding waste liquid, adjust the pH to 8 with 30% sodium hydroxide solution, stir for 2 minutes, and then ad...

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Abstract

The invention discloses a processing method of chemical mechanical polishing (CMP) waste liquid. The processing method is characterized in that the method comprises the following steps: firstly, the CMP waste liquid is processed by adopting a flocculation method; and secondly, the CMP waste liquid is processed by adopting an oxidation method. The invention aims to solve the technical problem of overcoming the defects in a conventional processing method of the CMP waste liquid that when a one-step method of oxidation and flocculation or a method of firstly oxidation and then flocculation is adopted, the use concentration and the use amount of coagulants and oxidants are high, the processing efficiency is low, the operation and the control are difficult, the cost is high, the drained water quality is unsteady, and the like, and providing the novel processing method of the CMP waste liquid; and by adopting the novel processing method, the COD (chemical oxygen demand) value in the CMP waste liquid is reduced, the oxidation efficiency is improved, and the processing cost of the CMP waste liquid is reduced.

Description

technical field [0001] The invention relates to a treatment method for chemical mechanical grinding waste liquid. Background technique [0002] The waste liquid produced by the chemical mechanical grinding method usually contains a variety of organic pollutants, but due to commercial confidentiality, the composition of some substances cannot be confirmed. These pollutants are produced in the grinding fluid, manufacturing process and back-end cleaning, usually including grinding pads, adhesives, corrosion inhibitors, metal complexing agents, surfactants, stabilizers, dispersants, organic acids and bases and other additives things. The types and concentrations of these organic compounds are usually quite different in different grinding liquids, and their solubility changes with the influence of pH value. [0003] As an important manufacturing process of integrated circuits, chemical mechanical polishing consumes a lot of water resources and produces a lot of polishing waste ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C02F1/72C02F1/52
Inventor 胡建华朱杰
Owner ANJI MICROELECTRONICS (SHANGHAI) CO LTD
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