Chip type oxygen sensor and preparation method thereof
An oxygen sensor and chip technology, which is applied in the field of chip oxygen sensor and its preparation, can solve the problems of low sensitivity, short service life, poor thermal shock resistance and other problems of oxygen sensor, and achieve improved sensitivity, long service life and enhanced adhesion Effect
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[0025] The invention also provides a method for preparing a chip oxygen sensor, which includes the following steps:
[0026] 1) Coat the insulating layer slurry, electrode slurry, and insulating layer slurry on the heater substrate, drying, and form an insulating layer on the heater substrate to obtain the first layer; take a reference gas substrate as Second layer
[0027] 2) Screen printing the transition layer slurry on the oxygen measuring electrolyte layer to form the transition layer; the transition layer slurry contains zirconia, magnesia-aluminum spinel and the first pore former; screen printing the porous layer slurry, A porous layer is formed on the layer; the slurry of the porous layer contains zirconia, magnesium-aluminum spinel, precious metals and a second pore-forming agent; the third layer is obtained; the zirconia cast sheet is taken and laser punched to obtain a compact Layer, as the fourth layer;
[0028] 3) The side of the insulating layer of the first sheet is ...
Example Embodiment
[0041] Example 1
[0042] (1) The heater substrate, the reference gas substrate blank, and the zirconia electrolyte substrate are prepared by the tape casting process; the insulating layer, the heating electrode, and the insulating layer are successively coated by the screen printing process on the heater substrate. The heater substrate is used as the first layer; the reference gas substrate blank is made by laser cutting air channels to make the reference gas substrate, as the second layer; the electrode is printed on both sides of the zirconia electrolyte substrate to make the oxygen electrolyte Floor.
[0043] (2) Raw material preparation:
[0044] Transition layer slurry: (a) Powder material: 65 parts by weight of zirconia; 27 parts by weight of magnesium-aluminum spinel; 5 parts by weight of activated carbon (particle size 1.8-4μm) as a pore-forming agent; 3 parts by weight of sintering aid ( Among them, 1 part by weight of alumina, 1 part by weight of magnesium oxide, and 1 p...
Example Embodiment
[0049] Example 2
[0050] The chip oxygen sensor of this embodiment is prepared by the same method as in embodiment 1, except that: in step (4), the area of the zirconia cast sheet is larger than the area of the transition layer and the porous layer, and the porous layer is completely covered. Floor.
[0051] Through the above steps, the chip oxygen sensor of this embodiment is obtained, which has figure 1 The structure shown in which the porous protective layer has Figure 4 The structure shown is denoted as A2.
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