Acidic etching solution not generating chlorine and catalyst of acidic etching solution

Abstract

The invention relates to acidic etching solution not generating chlorine and a catalyst of the acidic etching solution. The solution comprises mother solution, son solution and catalyst, wherein the mother solution consists of copper chloride solution, chloride ions and an acid group, the content of copper in the copper chloride solution is between 80 and 180 g / L, the content of the acid group is between 0.3 and 5.0 N, the sources of the chloride ions are hydrochloric acid or salt of various kinds of hydrochloric acid, and the content of the chloride ions is between 160 and 330 g / L; the son solution consists of chloride ions and an acid group, the content of the acid group is between 0.3 and 6.0 N, the sources of the chloride ions are hydrochloric acid or salt of various kinds of hydrochloric acid, and the content of the chloride ions is between 160 and 330 g / L; and the catalyst has the complexing action on monovalent copper ions and bivalent copper ions in the acidic etching solution, or can be used for the generation of stable coordination compounds, can be used for regulating oxidation-reduction potentials in a reaction A without the generation of chlorine.

Description

【Technical field】 [0001] The invention is used in the acidic copper chloride etching process used for high-precision and high-density line etching in the printed circuit board manufacturing industry, and specifically relates to an acid etching solution that does not generate chlorine gas and a catalyst thereof. 【Background technique】 [0002] At present, the electronic industry is developing rapidly. As a printed circuit board carrying electronic products, it must also develop in the direction of making more precise circuit graphics. The thinnest precision circuit has reached the level of 25um wire diameter and 25um spacing. In its manufacturing process, etching is an indispensable process in the process of manufacturing printed circuit boards. Usually, etching solutions are used to etch printed circuit boards. Commonly used etching solutions are divided into alkaline copper chloride etching solution and acidic copper chloride etching solution. In the etching process, the et...

AI Technical Summary

Problems solved by technology

[0038] The purpose of adding etching inhibitors is to achieve a high etching coefficient by forming a loose insoluble film, which will lead to a very slow etching rate, which is not only unacceptable for modern industries pursuing production efficiency, but also means that the dry film of corrosion resistance Or the ink needs to withstand a longer attack, which is not good for masking etching, and more critically, these two methods have not solved the problem of chlorine gas overflow

[0039] At the same time, the method of maintaining the content of divalent copper ions by adding an oxidant will cause the oxidant to be continuously absorbed by chloride ions (CL - ) is consumed by releasing chlorine gas, and divalent copper ions (Cu 2+ ) Local overconcentration, it is difficult to maintain a fast etching rate, and the oxidant needs to be continuously consumed during the etching process, which increases the cost of raw materials and the cost of the automatic addition system for controlling oxidant injection

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