Flexible substrate used in opto electronic device and preparation method thereof
A technology of optoelectronic devices and substrates, which is applied in the fields of electric solid-state devices, semiconductor/solid-state device manufacturing, photovoltaic power generation, etc., can solve the problems of poor bonding force between the conductive layer and the flexible substrate, poor surface flatness of the conductive layer, etc., and achieve high strength , improve the flatness, improve the effect of barrier ability
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Embodiment 1
[0092] Such as figure 1 As shown in the substrate structure, the flexible substrate 1 adopts a free radical type ultraviolet light curing adhesive, and the free radical type ultraviolet light curing adhesive includes 93% of base resin, 3% of monomer, 3% of photoinitiator and 1% of Photosensitizer and auxiliary agent, conductive layer 2 adopts graphene film.
[0093] The preparation method is as follows:
[0094] ①Clean the copper foil with surface roughness less than 1nm, and dry it with dry nitrogen after cleaning;
[0095] ② The graphene film is prepared on a clean rigid substrate by chemical vapor deposition; the preparation conditions include: methane is used as the carbon source, and the chemical vapor deposition growth environment of the graphene film is: a room temperature of 700°C to 1000°C. pressure or negative pressure;
[0096] ③ will be prepared with graphene film on the copper foil spraying free radical type ultraviolet light curing adhesive, said free radical ...
Embodiment 2
[0101] Such as figure 1 As shown in the substrate structure, the flexible substrate 1 adopts a free radical type ultraviolet light curing adhesive, and the free radical type ultraviolet light curing adhesive includes 99.5% of base resin, 0.2% of monomer, 0.2% of photoinitiator and 0.1% of Photosensitizer and auxiliary agent, conductive layer 2 adopts graphene film.
[0102] The preparation method is similar to Example 1.
Embodiment 3
[0104] Such as figure 1 As shown in the substrate structure, the flexible substrate 1 adopts a free radical type ultraviolet light curing adhesive, and the free radical type ultraviolet light curing adhesive includes 90% of the base resin, 2% of the monomer, 2% of the photoinitiator and 6% of the Photosensitizer and auxiliary agent, conductive layer 2 adopts graphene film.
[0105] The preparation method is similar to Example 1.
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