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Substrate for flexible photoelectronic device and preparation method thereof

A technology of optoelectronic devices and substrates, which is applied in the fields of electrical solid-state devices, semiconductor/solid-state device manufacturing, photovoltaic power generation, etc., and can solve the problems of large surface roughness of the conductive layer, poor bonding force between the conductive layer and the flexible substrate, etc.

Inactive Publication Date: 2011-10-05
UNIV OF ELECTRONICS SCI & TECH OF CHINA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The technical problem to be solved by the present invention is how to provide a substrate for flexible optoelectronic devices and its preparation method. The substrate solves the problems of large surface roughness of the conductive layer and poor bonding between the conductive layer and the flexible substrate, and improves the conductivity The binding force between the layer and the flexible substrate and the barrier ability of the substrate to water and oxygen

Method used

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  • Substrate for flexible photoelectronic device and preparation method thereof
  • Substrate for flexible photoelectronic device and preparation method thereof
  • Substrate for flexible photoelectronic device and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0093] Such as figure 1 In the substrate structure shown, the flexible substrate 1 uses an adhesive that requires double curing, and the conductive layer 2 uses a graphene film.

[0094] The preparation method is as follows:

[0095] ①Clean the copper foil with surface roughness less than 1nm, and dry it with dry nitrogen after cleaning;

[0096] ② The graphene film is prepared on a clean rigid substrate by chemical vapor deposition; the preparation conditions include: propane is used as the carbon source, and the chemical vapor deposition growth environment of the graphene film is: a room temperature of 700°C to 1000°C. pressure or negative pressure;

[0097] ③Spray the adhesive that needs double curing on the graphene film, and the raw material of the adhesive includes the following components:

[0098]

[0099] ④UV curing treatment on the surface of the copper foil for 30 seconds;

[0100] ⑤ Carry out thermal curing treatment on the surface of copper foil, the temper...

Embodiment 2

[0105] Such as figure 1 In the substrate structure shown, the flexible substrate 1 uses an adhesive that requires double curing, and the conductive layer 2 uses a graphene film. The raw material of the adhesive includes the following components:

[0106]

[0107] The preparation method is similar to Example 1.

Embodiment 3

[0109] Such as figure 1 In the substrate structure shown, the flexible substrate 1 uses an adhesive that requires double curing, and the conductive layer 2 uses a graphene film. The raw material of the adhesive includes the following components:

[0110]

[0111] The preparation method is similar to Example 1.

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Abstract

The invention discloses a substrate for a flexible photoelectronic device, comprising a flexible substrate and a conductive layer. The substrate for the flexible photoelectronic device is characterized in that the conductive layer is a graphene film while the flexible substrate is an adhesive needing to be doubly cured; and the adhesive needing to be doubly cured comprises an ultraviolet curing-heat curing system, an ultraviolet curing-microwave curing system, an ultraviolet curing-anaerobic curing system and an ultraviolet curing-electron beam curing system. According to the substrate, the problems of large roughness of the conductive layer and poor bonding force between the conductive layer and the flexible substrate are solved, the bonding force between the conductive layer and the flexible substrate is increased and the blocking capability of the substrate to water and oxygen is also improved.

Description

technical field [0001] The invention relates to the technical field of organic optoelectronics, in particular to a substrate for a flexible optoelectronic device and a preparation method thereof. Background technique [0002] Optoelectronics technology is a rapidly developing industry with high technological content after microelectronics technology. With the rapid development of optoelectronic technology, optoelectronic products such as solar cells, optical image sensors, flat panel displays, and thin film transistors have gradually matured, and they have greatly improved people's lives. At the same time, the wide application of optoelectronic information technology in various fields of social life has also created a huge growing market. Developed countries regard the optoelectronic information industry as one of the key development areas, and the competition in the optoelectronic information field is unfolding worldwide. [0003] The wide application of organic materials...

Claims

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Application Information

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IPC IPC(8): H01L51/44H01L51/46C09J175/14C09J167/06C09J4/00C09J4/02C09J163/00H01L51/48
CPCY02E10/549Y02E10/50
Inventor 于军胜李璐于欣格蒋亚东
Owner UNIV OF ELECTRONICS SCI & TECH OF CHINA