Bridge-driven IPM (intelligent power module) circuit for three-phase electric machine

Abstract

The invention discloses an intelligent power module circuit for three-phase motor bridge drive, which includes a gate drive chip, a set of high-voltage side power devices and a set of low-voltage side power devices, and the gate drive chip is controlled by the high-voltage side to drive the chip It is composed of a low-voltage side control driver chip, the high-voltage side control driver chip is integrated by a high-voltage side driver module, and the low-voltage side control driver chip is integrated by a low-voltage side driver module, an operational amplifier and a low-voltage regulator circuit. The advantage lies in the use of complex high-voltage isolation manufacturing processes Only the high-voltage side control driver chip is produced, and the area of ​​the high-voltage side control driver chip is small, which makes the production and processing process of the high-voltage side control driver chip easier to control and is more conducive to improving the yield rate; due to the use of ordinary CMOS technology to produce low-voltage For the side control driver chip, the ordinary CMOS process has simple process conditions, mature technology, and thinner feature lines, so the chip area can be made smaller, which can effectively ensure the production yield and save costs.

Description

technical field [0001] The invention relates to a bridge drive circuit, in particular to an intelligent power module circuit used for bridge drive of a three-phase motor. Background technique [0002] The bridge drive circuit is a common application circuit in the field of switching power supplies. The bridge drive circuit generally includes a half-bridge drive circuit, a full-bridge drive circuit and a three-phase bridge drive circuit. Two half-bridge drive circuits can be combined into a full Bridge drive circuit, three half-bridge drive circuits can be combined into a three-phase bridge drive circuit. Among them, the three-phase bridge drive circuit is often used in such three-phase motor products as fans, inverter air conditioners, inverter washing machines, inverter microwave ovens, and automobile motor drives. figure 1 A typical three-phase motor bridge drive intelligent power module circuit is given, and the three-phase motor bridge drive intelligent power module ci...

AI Technical Summary

Problems solved by technology

[0003] In existing applications, the intelligent power module circuit for three-phase motor bridge drive usually adopts the power module integration method to integrate a single gate driver chip, operational amplifier circuit, low-voltage regulator circuit and six power devices into one module. This method, on the one hand, in the manufacture of intelligent power module devices, since the chip area of ​​the six power devices is relatively large, and the power devices generate heat during operation, the distance between each power device is often required to be large during assembly. However, the area of ​​the gate drive chip is often small, so the connection between the gate drive chip and each power device will be very long, which will greatly reduce the reliability of the intelligent power module circuit, which is not conducive to production and reliability control; On the one hand, when manufacturing gate drive chips, it is necessary to integrate the high-voltage isolation manufacturing process into the ordinary CMOS process for production. The purpose of using the high-voltage isolation manufacturing process is to isolate the high-voltage side driver module from the low-voltage side driver module. The CMOS process integrated high-voltage isolation manufacturing process is complicated. In order to withstand high voltage, the process can achieve a large feature size. The part that originally only needs a small feature size must also use a large feature size, so that the feature size of the manufactured gate drive chip Larger, resulting in the gate drive chip with the same function occupying too much area, and increasing the production cost of a single gate drive chip; It is not conducive to the design of chips with complex functions, such as integrating operational amplifier circuits, low-voltage regulator circuits, etc., because the area of ​​chips with complex functions will be larger when using this gate driver chip, and the production yield will also be reduced. , the production cost will also increase

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