Method for preparing reinforced tungsten carbide abrasion-resistant composite plate
A tungsten carbide and composite plate technology, applied in chemical instruments and methods, coatings, layered products, etc., can solve problems such as inability to meet wear resistance requirements, and achieve simplified production process flow, improved production efficiency, and reduced production costs. Effect
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Embodiment 1
[0042] (1) Select Q235 low-carbon steel plate as the substrate, the size of the substrate is 1m×2m, and the thickness is 8mm. Use the commonly used shot peening method to remove oil and rust on the surface of the substrate.
[0043] (2) Place the substrate cleaned in step (1) horizontally with the cleaned side facing up. Evenly spread the film remover on the cleaned substrate surface, the thickness of the film remover is 0.2mm, and the composition (mass percentage) of the film remover is 25% of borax and 75% of boric acid.
[0044] (3) Evenly spread the alloy powder on the surface of the film remover in step (2), the particle size of the alloy powder is-40 mesh~+300 mesh, the thickness of the alloy powder is 5mm, and the composition (mass percentage) of the alloy powder is: C is 3.6%, Cr is 30%, B is 2.1%, Si is 1.8%, Mo is 3.0%, Ni is 4.0%, and the rest is Fe and impurities that do not affect the properties of the alloy powder.
[0045] (4) On the surface of the alloy powde...
Embodiment 2
[0049] (1) Select Q345 steel plate as the substrate, the size of the substrate is 1m×1.5m, and the thickness is 10mm. The surface of the substrate is cleaned by a common chemical method of a mixed aqueous solution of sulfuric acid and hydrochloric acid. The pickling parameters are: a mixed aqueous solution of 9% sulfuric acid by volume and 6% hydrochloric acid by volume. The pickling temperature is 20°C and the pickling time is 10 minutes.
[0050] (2) Place the substrate cleaned in step (1) horizontally with the cleaned side facing up. Evenly spread the film remover on the cleaned substrate surface, the thickness of the film remover is 0.5mm, and the composition (mass percentage) of the film remover is 80% boric acid, 15% borax, and 5% calcium fluoride.
[0051] (3) Evenly spread the alloy powder on the surface of the film remover in step (2), the particle size of the alloy powder is-40 mesh~+300 mesh, the thickness of the alloy powder is 6mm, and the composition (mass percen...
Embodiment 3
[0056] (1) Select Q195 steel plate as the substrate, the size of the substrate is 0.5m×1.0m, and the thickness is 6mm. Use the commonly used sulfuric acid aqueous solution chemical method to clean the surface of the substrate. The pickling parameters are: 10% sulfuric acid aqueous solution by volume percentage, the pickling temperature is 50°C, and the pickling time is 15 minutes.
[0057] (2) Place the substrate cleaned in step (1) horizontally with the cleaned side facing up. Evenly spread the film remover on the cleaned substrate surface, the thickness of the film remover is 0.2mm, and the composition (mass percentage) of the film remover is 100% boric acid.
[0058] (3) Evenly spread the alloy powder on the surface of the film remover in step (2), the particle size of the alloy powder is-40 mesh~+300 mesh, the thickness of the alloy powder is 1mm, and the composition (mass percentage) of the alloy powder is: C is 3%, Cr is 28%, B is 2.5%, Si is 2.0%, Mo is 3.5%, Ni is 4.5...
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