Method for preparing ultralow expanding ceramic material
A ceramic material and manufacturing method technology, applied in the manufacturing field of ultra-low expansion ceramic materials, can solve the problems of narrow sintering temperature range, strict conditions of green body particle size, insufficient performance, etc., achieve reliable and stable product quality, and reduce production energy consumption , the effect of convenient for wide application
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Examples
Embodiment 1
[0019] Embodiment 1, composition by weight ratio: spodumene: 63kg, A1 2 o 3 :17kg, Si0 2 : 22kg, kaolin: 8kg, additive (PVA): 3kg.
[0020] Grind according to the weight ratio of ball: material: water = 1.6:1.0:1.2. The slurry is passed through a 250-mesh sieve, and the sieve residue is less than 0.1%. The slurry is iron-absorbed, spray-dried, pressed, and fired at 1300 ° C. After heat preservation for 30 minutes, the water absorption rate of the made ceramic plate: 0.27%, modulus of rupture: 50.3MPa, shock resistance 720°C-20°C heat exchange without cracking once, thermal expansion coefficient: 0.92×10 -6 / °C.
Embodiment 2
[0021] Embodiment two, composition by weight ratio: spodumene: 70kg, A1 2 o 3 :10kg, Si0 2 : 34kg, kaolin: 6kg, additive (PVA): 3kg.
[0022] Grind according to the weight ratio of ball:material:water:=1.6:1.0:1.2. The slurry is passed through a 250-mesh sieve, and the sieve residue is less than 0.1%. The slurry is iron-absorbed, spray-dried, press-molded, and fired at 1300°C , heat preservation for 30min, the water absorption rate of the made ceramic plate is 0.13%, the modulus of rupture: 53.4MPa, the thermal shock resistance is 720°C-20°C heat exchange without cracking once, the coefficient of thermal expansion: 0.95×10 -6 / °C.
PUM
| Property | Measurement | Unit |
|---|---|---|
| Modulus of rupture | aaaaa | aaaaa |
| Thermal expansion coefficient | aaaaa | aaaaa |
| Modulus of rupture | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
Login to View More