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Novel method for manufacturing chip diode

A manufacturing method and diode technology, applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve the problems of high energy consumption, low efficiency, and complexity, and achieve the effects of reducing pollution, high efficiency, and reducing corrosion

Inactive Publication Date: 2011-11-09
RUGAO EADA ELECTRONICS
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  • Summary
  • Abstract
  • Description
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  • Application Information

AI Technical Summary

Problems solved by technology

Existing SMD diode chips are generally made by chip GPP and copper frame with multiple glass firing and multiple photolithography. Due to the complexity and high cost in the production process, and the need for pre-welding in the production process, the two Only one welding can be completed, the efficiency is low, and its energy consumption is large; therefore, it is necessary to improve the existing production method of SMD diodes to ensure the performance of the product and greatly reduce the cost

Method used

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Embodiment Construction

[0013] A method for manufacturing a chip diode, which comprises the following steps:

[0014] (1) Put the two copper lead electrodes, solder tabs, and diode chips into the fixture, and send them to the welding furnace for heating. The temperature is t 1 For: 290℃≤t 1 ≤305℃, temperature control time h 1 For: 14 minutes≤h 1 ≤16 minutes, using nitrogen as the shielding gas during welding;

[0015] (2) Slowly drop the diode material of step (1) to t along with the temperature of the welding furnace 2 For: 95℃≤t 2 ≤105℃, temperature control time h 2 For: 28 minutes≤h 2 ≤32 minutes;

[0016] (3) loading the diode material of step (2) into the pickling dish;

[0017] (4) Pickling the diode material in step (3) once, and the pickling solution is: HF:HNO 3 :HAC:H 2 SO 4 =9:9:12:4, volume ratio corrosion to remove the dicing mechanical damage layer, time h 3 For: 135 seconds≤h 3 ≤155 seconds;

[0018] (5) The diode material in step (4) is flushed with high-purity water in ...

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Abstract

The invention discloses a novel method for manufacturing a chip diode. The method comprises the following steps of: welding two copper leading wire electrodes of the diode, a soldering lug and a diode chip; pickling; washing by using high purity water; washing by using absolute ethanol; drying; coating; injecting; and processing a pin to form a finished product. The method is characterized in that: in the step of pickling, pickling is performed by adding acid liquor at a fixed point; in the step of washing by using the high purity water, the diode is washed by spraying water flow in a fan-shaped manner. According to the method, a mode of acid addition during pickling is changed, the traditional scattered mode is changed into the method of acid liquor addition at the fixed point, the acid consumption is reduced, the pollution to the environment is reduced, the corrosion to copper leading wires is reduced; and the high temperature performance of a product is greatly improved during washing, and the production process is simple and mature, high in efficiency, and low in energy consumption.

Description

technical field [0001] The present invention relates to the manufacture of semiconductor diodes, in particular to a method of manufacture of chip diodes with low cost and superior performance. Background technique [0002] With the advancement of science and technology, the electrical industry is developing in the direction of high integration and high power, and the cost of raw materials continues to rise, which puts forward higher requirements for the cost and quality of SMD diodes. Existing SMD diode chips are generally made of GPP chips and copper frames with multiple glass firings and multiple lithography. Due to the complicated and high production process, and the high cost, and because the production process needs to be pre-soldered, the two It can be completed only after the second welding, the efficiency is low, and the energy consumption is large; therefore, it is necessary to improve the existing SMD diode production method to ensure the performance of the product...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/329H01L21/00
Inventor 黄建山张练佳陈建华梅余锋贲海蛟
Owner RUGAO EADA ELECTRONICS
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