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A homogeneous conductive paste

A technology of conductive paste and functional phase, which is applied in the field of preparation of thick film electronic paste, and can solve problems that have not been solved well

Inactive Publication Date: 2011-12-07
HUAZHONG UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Many researchers at home and abroad mostly solve this problem by adding surfactants (such as Chinese patent CN1055164A), surface modification of solid particles, microwave solubilization, etc., but from the current available literature, this problem still not well resolved

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0020] Dissolve 5 g of the precursor copper formate in 10 g of water to obtain an aqueous solution of copper formate; dissolve 3 g of sodium carboxymethyl cellulose in 3 g of water, add 0.2 g of sodium dodecylbenzene sulfonate, and dissolve to obtain a carrier phase; The aqueous solution of copper formate is mixed with the carrier, and mechanically stirred evenly to obtain the slurry of the present invention.

[0021] After the slurry was spin-coated on a quartz glass substrate to form a film, it was dried at 65°C for 30 min, and then 2 Laser or Nd:YAG treatment, can get conductive layer or conductive line, its volume resistivity is about 4.7×10 -5 Ω·cm.

Embodiment 2

[0023] Dissolve 1 g of the precursor silver pentafluoropropionate in 7 g of methanol to obtain a methanol solution of the precursor; dissolve 2 g of ethyl cellulose in 9.6 g of terpineol, add 0.4 g of Span-85 to obtain a carrier phase; Mix the methanol solution of the substance with the carrier, continue stirring evenly, and then ultrasonically disperse to obtain the slurry of the present invention.

[0024] The slurry is directly written on the ceramic substrate with a micro-pen (tip inner diameter of 20 μm) direct writing device, first dried at 50°C for 20 minutes, and then sintered at 450°C for 30 minutes to obtain a conductive pattern with a resolution of up to 20 μm Around, the volume resistivity is about 6.2×10 -5 Ω·cm.

Embodiment 3

[0026] Dissolve 18g of precursor tetrachloroalloy acid in 6g of water to obtain the aqueous solution of precursor; dissolve 2g of polyvinyl alcohol in 3.7g of water, add 0.3g of sodium dodecylbenzenesulfonate, and dissolve to obtain a carrier phase; The above-mentioned precursor aqueous solution is mixed with the carrier, and mechanically stirred evenly to obtain the slurry of the present invention.

[0027] The slurry is screen printed on the ceramic substrate, dried at 70°C for 20 minutes, and then sintered at 350°C for 40 minutes to obtain a conductive pattern with a volume resistivity of about 8.3×10 -5 Ω·cm.

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Abstract

The invention discloses a homogeneous conductive paste, which is composed of a precursor of a conductive functional phase and a carrier phase: the mass percentage of the precursor of a conductive functional phase is 5-60%, and the rest is a carrier phase; the carrier The phase is composed of multiple components, and the mass fraction of each component relative to the carrier phase is respectively: thickener 2-20%, dispersant 1-10%, and the rest is solvent. The homogeneous conductive paste does not contain particle functional phases and other solid phases, but contains functional phase precursors, which can be well dissolved in the solvent of the binder phase, and can be used in the subsequent post-treatment process In the process, it can be converted into a conductive functional phase; the slurry avoids the problem of particle settling and agglomeration during the preparation and storage of the traditional slurry containing the particle functional phase; It can be processed and formed by methods such as micro-spraying and direct writing, and after post-treatment such as drying and sintering, a conductive line or pattern with good conductivity and high resolution can be obtained.

Description

technical field [0001] The invention belongs to the preparation technology of thick-film electronic paste in microelectronic technology, and specifically relates to a homogeneous conductive paste, which does not contain solid particle phase and other solid phases, and the whole paste system is a homogeneous system is a true solution. Background technique [0002] Electronic paste is an electronic functional material integrating materials, metallurgy, chemical industry, and electronic technology. It is the basic material for hybrid integrated circuits, sensitive components, surface mount technology, resistor networks, displays, and various electronic discrete devices. It occupies an important position in the field of information and electronics with its high quality, high efficiency, advanced technology, and wide application. It is widely used in aviation, aerospace, electronic computers, measurement and control systems, communication equipment, medical equipment, automotive ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01B1/22
Inventor 刘建国曾晓雁曹宇李祥友沈龙光王小叶
Owner HUAZHONG UNIV OF SCI & TECH
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