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Organic optoelectronic device wrapper and device packaging method

An optoelectronic device, organic technology, applied in the field of organic optoelectronic device packaging, can solve the problems of poor packaging tightness, low service life, poor packaging effect, etc. Effect

Inactive Publication Date: 2013-04-17
UNIV OF ELECTRONICS SCI & TECH OF CHINA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] In order to overcome the shortcomings of the existing organic photoelectric device packaging methods, such as poor packaging tightness, inability to reduce water vapor permeability, poor packaging effect and low service life, the purpose of the present invention is to provide an organic photoelectric device packager

Method used

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  • Organic optoelectronic device wrapper and device packaging method
  • Organic optoelectronic device wrapper and device packaging method
  • Organic optoelectronic device wrapper and device packaging method

Examples

Experimental program
Comparison scheme
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preparation example Construction

[0039] Preparation method 1 of the base plate and the cover plate:

[0040] ①Use detergent, acetone solution, absolute ethanol solution and deionized water in sequence to ultrasonically clean the transparent conductive substrate ITO glass and transparent cover glass, and blow dry with dry nitrogen after cleaning. The ITO film on the glass substrate is used as the anode layer of the device, the square resistance of the ITO film is 10-15 Ω / sq, and the film thickness is 1500 ?;

[0041] ② Move the dried substrate and cover plate into a high vacuum chamber, and pretreat the ITO glass with low-energy oxygen plasma bombardment for 10 min in an oxygen and argon atmosphere with a pressure of 20 Pa, and the sputtering power is ~20 W;

[0042] ③Transfer the processed substrate to the organic vacuum evaporation chamber, and wait until the pressure in the chamber is lower than 4×10 -4Pa, the vapor deposition of the organic thin film is started. The hole injection layer evaporated in seq...

example 1

[0062] In the basic structure of the organic electroluminescent diode (OLED) packaging system, the device substrate uses a 200mm-200mm glass substrate, the packaging cover plate is etched with soda-lime glass, and the sealant is epoxy resin UV-curable glue. The entire device structure is described as: glass substrate / ITO / CuPc (200 ?) / α-NPD (600 ?) / Alq 3 (400?):C545T (x %,x=1, 2, 3, 4, 5, 6, 7) / Alq 3 (200?) / LiF (10?) / Al (1000?). The preparation of the substrate and the cover of the device is similar to the preparation method of the substrate and the cover, and the packaging method adopts the above-mentioned organic photoelectric device packaging method.

Embodiment 2

[0064] In the basic structure of the packaging system of organic optoelectronic devices, the device substrate adopts a glass substrate of 370 mm to 470 mm, the packaging cover adopts a flexible cover (such as polyethylene terephthalate-PET, etc.), and the sealant adopts epoxy Resin UV curing glue. The entire device structure is described as: glass substrate / ITO / PEDOT:PSS (200 ?) / NPB (300 ?) / AND (400 ?):DPAVBi(x %, x=1, 2, 3, 4, 5, 6 , 7, 8, 9, 10) / Alq 3 (200?) / LiF (10?) / Al (1500?). The preparation of the substrate and the cover is similar to the second method of preparing the substrate and the cover, and the packaging method adopts the packaging method of the above-mentioned organic photoelectric device.

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Abstract

The invention discloses an organic optoelectronic device wrapper and a device packaging method, belongs to the field of optoelectronic devices in organic optoelectronic devices. According to the invention, the package of organic optoelectronic devices can be realized. The organic optoelectronic device wrapper comprises a sealing cavity (12), a button (1), a positioning base (2), a rotatable gasket (3) and a gas filling duct (4), wherein the positioning base (2) which is used for preventing a substrate from moving and the rotatable gasket (3) are arranged in the sealing cavity (12); the rotatable gasket can be controlled through the button which is placed on the exterior of the sealing cavity; and high-purity inert gas can be controlled by a gas filling valve (5) which is placed outside the sealing cavity. Compared with the traditional packaging device, the optoelectronic device wrapper can directly fill the high-purity inert gas into the sealing cavity without passing through a glove box, thus the purity of the inert gas between the substrate of the optoelectronic device and a cover plate can be improved, the tight fit degree of the cover plate and the substrate can be enhanced, the packaging precision can be ensured and the service life of the optoelectronic device can be improved.

Description

technical field [0001] The invention belongs to the field of optoelectronic devices in organic electronic components, and in particular relates to a packager of organic photoelectric devices and a packaging method thereof. Background technique [0002] As early as 1987, C. W. Tang found that in argon atmosphere, constant current (5 mA / m 2 ), the initial brightness is (50 cd / m 2 ) working conditions, the brightness of the device decays at a faster rate in the initial short working time, and after the device works continuously for 100 h, the brightness drops to half of the initial brightness; at the same time, the driving voltage of the device gradually increases from 6 V to 14 V, Luminous areas are accompanied by the formation of non-luminous dark spots. At that time, this phenomenon was attributed to the failure of the electrode contact. Following C. W. Tang, L. M. Do et al. used a variety of in-situ and real-time analysis methods to conduct a comprehensive and detailed o...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L51/00H01L51/56H01L51/48H10K99/00
CPCY02E10/50Y02E10/549
Inventor 于军胜钟建高娟蒋亚东
Owner UNIV OF ELECTRONICS SCI & TECH OF CHINA