Method and device for forming and assembling microscale part

Abstract

The invention discloses a method and a device for forming and assembling a microscale part, and is applied to the forming and the assembly of micro-precision parts such as integrated circuits and microelectronic products. According to the method, flat top type strong pulse laser illuminates on a restraint layer to form pressure wave to impact a target and make the target locally and rapidly expanded; a micro-blanking material flying at a high speed is obtained under the action of a cutting mould; the micro-blanking material flies at a high speed and then hits against a part to be assembled, so the surface appearance of the part to be assembled is copied and microscale forming is formed; and the speed of the formed microscale part is reduced to zero, the formed microscale part is attached onto the upper surface of the part and then assembled, and the positioning and the installation of the microscale part are performed, so the integration of the forming and the assembly of the microscale part is realized. By the method, the forming and the assembly of the microscale part can be realized simultaneously; therefore, the method is a modern micro-device making method which integrates the processing and the assembly of the microscale part, and has the processing characteristics of high flexibility and high efficiency. Moreover, rapid industrialized production in a large scale is easyto realize.

Description

Technical field [0001] The present invention relates to the field of micro-processing, manufacturing and assembly, in particular to a method and device for forming and assembling micro-scale parts, which is suitable for the manufacture of micro-precision parts such as integrated circuits and microelectronic products, and can simultaneously realize the forming and assembly of micro-scale parts , Is a modern micro-device manufacturing method that is easy to realize mass industrial production. Background technique [0002] With the rapid development of micro electro mechanical sys-tem (MEMS), the demand for micro components is also increasing. At present, micro metal products manufactured through micro-forming technology have been widely used in many fields such as automation, medical and health, aerospace, telecommunications and electronics, precision instruments, and national defense. At the same time, new requirements are put forward for the processing technology, processing cos...

AI Technical Summary

Problems solved by technology

The demolding methods on the macro scale, such as ejection, air blowing, etc., are easy to damage the workpiece and the mold when the micro-devices are demolded, and it has been difficult to use. However, the demoulding methods commonly used in micro-forming are difficult to precisely control the demoulding The thickness of the agent has a certain influence on the precision of micro-forming; and the demolding method of soaking the formed workpiece and the mold in an organic solvent will not only take a long time to demould, but also leave organic solvents on the surface of the workpiece and the mold; heat the mold and the workpiece to a certain Temperature, the method of demoulding using thermal stress between the two has not yet formed a substantive standard

[0005] Researchers are actively looking for suitable micro-plastic forming processing methods. For example, the patent with the publication number CN1903473 proposes a micro-thermoforming method. Although micro-forming can be achieved, the punch needs to be heated, which increases the complexity of the process; the publication number is The patent of CN101318204 proposes a method of infrared heating metal foil air pressure forming. Although the forming ability of the foil is improved, the foil needs to be heated, the process is complicated and the mechanical properties of the obtained micro-formed parts are poor; the publication number is The laser composite microplastic forming device and method proposed in the patents of CN102029317A and CN102009268A can use the laser mechanical effect to combine with the micro-mold to obtain micro-scale parts, but the processing of micro-scale molds is difficult, the mechanical properties of the mold are poor, and micro-scale parts need to be processed. Subsequent demoulding of parts; the patent with publication number CN101920397A proposes a strong laser moldless forming method based on diffractive micro-optical elements. Although demoulding is not required, the controllable forming performance is poor, and subsequent part clamping is still required and assembly

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