A device for preparing nonlinear dendritic wicks by selective laser melting

A selective laser melting and non-linear technology, which is applied in the field of electronic manufacturing industry, can solve the problems that mechanical processing and sintering methods are difficult to complete, processing methods cannot be directly prepared, and the working capacity of the liquid-absorbing core structure is slow, etc., to achieve simple structure, The effect of low production cost and small backflow resistance

Inactive Publication Date: 2011-12-14
SOUTH CHINA UNIV OF TECH
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Problems solved by technology

The reason is: to improve the solid-liquid and solid-vapor interface structure to enhance the boiling (evaporation section) and condensation (condensation section) capabilities, as well as to improve the capillary suction and reduce the reflux resistance, so that the surface microstructure of the ideal heat-absorbing core , microchannel size and porosity vary nonlinearly in the radial and axial directions, so machining and sintering methods are difficult to complete
[0007] However, experimental s

Method used

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  • A device for preparing nonlinear dendritic wicks by selective laser melting
  • A device for preparing nonlinear dendritic wicks by selective laser melting
  • A device for preparing nonlinear dendritic wicks by selective laser melting

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Embodiment

[0032] Such as figure 1 . The non-linear tree-shaped liquid-absorbing core device prepared by selective laser melting of the present invention includes a controller 1, a laser generator 2, an optical path transmission original 3, a scanning galvanometer system 4, an F-θ mirror 6, a molding chamber 7, and an air inlet 8. Air outlet 9, CNC mobile brush 10, forming part lifting cylinder 11, powder lifting cylinder 12, powder recovery cylinder 13; the laser generator 2, optical transmission original 3, scanning galvanometer system 4, F-θ mirror 6. Set the connection in the optical path in turn;

[0033] The F-θ mirror 6 is arranged in the middle of the upper end of the molding chamber 7, the air inlet 8 is arranged at the upper end of the inner wall on one side of the molding chamber 7, and the gas outlet 9 is arranged at the lower end of the inner wall on the other side of the molding chamber 7, The molding chamber 7 is also provided with a digitally controlled movable brush pie...

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Abstract

The invention discloses a non-linear tree-shaped liquid-absorbing core device prepared by selective laser melting. , formed parts lifting cylinder, powder lifting cylinder, powder recovery cylinder; the invention can quickly prepare "tree-like structure" liquid-absorbing cores with any pipe diameter ratio and bifurcation angle, which can be used for scientific research and meet high efficiency The needs of the cutting-edge field of heat pipes; the present invention also provides a solution that utilizes a spectroscopic system and a double-scanning galvanometer system to manufacture two liquid-absorbing cores with different structures at a time, which improves efficiency while ensuring quality; Some experimental studies on liquid-absorbing cores and the preparation of high-quality liquid-absorbing core structures are of great significance; the present invention has simple structure, convenient and quick operation, low production cost, and has the value of active popularization and application.

Description

technical field [0001] The invention belongs to the technical field of electronic manufacturing industry, and in particular relates to a device for preparing a non-linear tree-shaped liquid-absorbing core by selective laser melting. Background technique [0002] As the heat flux required for heat dissipation of electronic devices continues to increase, heat pipes have excellent characteristics such as extremely high thermal conductivity, excellent isothermal properties, heat flux variability, and adaptability to constant temperature environments, which can meet the needs of electronic and electrical equipment for heat dissipation. Compact, Reliable, flexible control, high heat dissipation efficiency, no need for maintenance and other requirements. Therefore, heat pipe technology has become the preferred technology for heat dissipation of electrical equipment, electronic device cooling, semiconductor components and large-scale integrated circuit board heat dissipation. [00...

Claims

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Application Information

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IPC IPC(8): B22F3/105
CPCY02P10/25
Inventor 黄延禄杨彦哲汤勇杨永强
Owner SOUTH CHINA UNIV OF TECH
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