A device for preparing nonlinear dendritic wicks by selective laser melting

Abstract

The invention discloses a non-linear tree-shaped liquid-absorbing core device prepared by selective laser melting. , formed parts lifting cylinder, powder lifting cylinder, powder recovery cylinder; the invention can quickly prepare "tree-like structure" liquid-absorbing cores with any pipe diameter ratio and bifurcation angle, which can be used for scientific research and meet high efficiency The needs of the cutting-edge field of heat pipes; the present invention also provides a solution that utilizes a spectroscopic system and a double-scanning galvanometer system to manufacture two liquid-absorbing cores with different structures at a time, which improves efficiency while ensuring quality; Some experimental studies on liquid-absorbing cores and the preparation of high-quality liquid-absorbing core structures are of great significance; the present invention has simple structure, convenient and quick operation, low production cost, and has the value of active popularization and application.

Description

technical field [0001] The invention belongs to the technical field of electronic manufacturing industry, and in particular relates to a device for preparing a non-linear tree-shaped liquid-absorbing core by selective laser melting. Background technique [0002] As the heat flux required for heat dissipation of electronic devices continues to increase, heat pipes have excellent characteristics such as extremely high thermal conductivity, excellent isothermal properties, heat flux variability, and adaptability to constant temperature environments, which can meet the needs of electronic and electrical equipment for heat dissipation. Compact, Reliable, flexible control, high heat dissipation efficiency, no need for maintenance and other requirements. Therefore, heat pipe technology has become the preferred technology for heat dissipation of electrical equipment, electronic device cooling, semiconductor components and large-scale integrated circuit board heat dissipation. [00...

AI Technical Summary

Problems solved by technology

The reason is: to improve the solid-liquid and solid-vapor interface structure to enhance the boiling (evaporation section) and condensation (condensation section) capabilities, as well as to improve the capillary suction and reduce the reflux resistance, so that the surface microstructure of the ideal heat-absorbing core , microchannel size and porosity vary nonlinearly in the radial and axial directions, so machining and sintering methods are difficult to complete

[0007] However, experimental studies have shown that the heat transfer capacity of the wick structure produced by the three traditional processing methods is much lower than that of the "tree-like" wick structure

However, due to the complexity and irregularity of the "tree-like structure", traditional processing methods cannot be directly prepared, making the improvement of the working capacity of the liquid-absorbent core structure very slow, which has become a factor restricting the development of heat dissipation technology.

Images