Composite integrated sensor structure and manufacturing method thereof

Abstract

Provided is a method for manufacturing a composite integrated sensor structure, including the steps of: providing a substrate and forming a doped region thereon; etching the substrate to form a groove for making a cavity; depositing a barrier layer on the substrate surface and the groove side-wall and the groove bottom; removing the barrier layer from the substrate surface and the groove bottom, and forming side-wall protection layers on the groove side-wall; the hard mask on the substrate and the side-wall protection layers interacting with each other to continue etching the groove to form a deep groove; corroding the deep groove to form a cavity inside the substrate; filling in an isolation and / or filling material between the side-wall protection layers of the groove to form a plug structure so as to isolate the cavity from the outside; flattening the substrate surface; making an electrically conductive lead and an electrode on the substrate surface; depositing a mass block in the region of an acceleration transducer and imaging same; and forming an isolation groove around the mass block, the mass block being connected to the substrate in a cantilevered manner. The present invention adopts a process which is positive and compatible with the conventional semiconductor process and has the advantages of being practical, economical, high-performance and the like.

Description

technical field [0001] The invention relates to the technical field of micro-electromechanical systems (MEMS) manufacturing, in particular, the invention relates to a composite integrated sensor structure integrating a temperature sensor, an acceleration sensor and a pressure sensor and a manufacturing method thereof. Background technique [0002] With the development of sensor technology, the sensor chip no longer contains a single sensor device, but appears more in the form of a system on chip (SOC or SIP). In a system-on-chip, multiple sensor device units are often integrated, and even peripheral CMOS integrated circuits are included to form a systematic on-chip composite integrated sensor structure. The appearance of the on-chip sensing system makes the integration of the sensor higher and higher, the function stronger and smaller, and the cost is significantly reduced at the same time. [0003] The structure and manufacturing method of composite integrated sensors are ...

AI Technical Summary

Problems solved by technology

These processes are the current mainstream, but they are not compatible with conventional semiconductor processes. Therefore, customized sensor processing production lines are required, which increases production costs.

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