Forming method for semiconductor pipe core and conductive pillar

Abstract

An embodiment in the invention discloses a forming method for a semiconductor pipe core and a conductive pillar. The semiconductor pipe core comprises a conductive pillar disposed at the semiconductor pipe core. A substrate is provided. A bond pad is over the substrate. A conductive pillar is over the bond pad. The conductive pillar has a top surface, edge sidewalls and a height. A cap layer is over the top surface of the conductive pillar. The cap layer extends along the edge sidewalls of the conductive pillar for a length. A solder material is over a top surface of the cap layer. The method provided in the invention can improve the structure and forming method of a copper pillar and can be applied in a semiconductor chip, making the semiconductor chip be provided with strong electric efficiency.

Description

Technical field [0001] The invention relates to a semiconductor packaging process, in particular to a structure of a conductive pillar in flip chip packaging and a method for forming the same. Background technique [0002] In the packaging of semiconductor components, flip chip technology plays an important role. Flip-chip microelectronics assembly involves direct electrical connections between a substrate (such as a circuit board) and flip-chip electronic components, and the internal wiring uses solder bumps. The advantages of flip-chip packaging are size reduction, increased performance, and flexibility of the packaged chip. Therefore, the growth rate of flip-chip packaging is much higher than other packaging methods. [0003] In the recently developed copper pillar technology, copper pillars are used instead of solder bumps to connect electronic components to the substrate. The distance between the copper pillars is small, and the possibility of short-circuit bridging is low, ...

AI Technical Summary

Problems solved by technology

[0004] However, the stress can cause fractures along the interface between the copper pillar and the solder used to join the electronic components

The above fragmentation will cause leakage current, which will cause serious reliability problems

Stresses can also cause cracking of the underfill along the interface between the underfill material and the copper pillars

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