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Substrate for mounting light-emitting element, production process thereof and light-emitting device

A technology for light-emitting elements and manufacturing methods, which is applied to electrical components, electric solid-state devices, semiconductor devices, etc., can solve the problems of light-emitting devices (decrease in brightness, decrease in reflectivity, etc.), achieve reflectivity that is not easy to decrease, reduce process load, and eliminate The effect of uneven light distribution characteristics

Inactive Publication Date: 2012-02-08
AGC INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

As a result, the reflectance decreases, and the luminosity (brightness) of the light-emitting device may decrease

Method used

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  • Substrate for mounting light-emitting element, production process thereof and light-emitting device
  • Substrate for mounting light-emitting element, production process thereof and light-emitting device
  • Substrate for mounting light-emitting element, production process thereof and light-emitting device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1～12

[0079] Embodiment 1~12, comparative example

[0080] First, a glass-ceramic composition for a protective layer is prepared. That is, blending and mixing glass raw materials makes SiO 2 , B 2 o 3 、Al 2 o 3 , CaO, Na 2 O and K 2 Each component of O is the composition (mol %) shown in Table 1. This raw material mixture was put into a platinum crucible, and after melting at 1500-1600° C. for 60 minutes, the molten glass was poured out and cooled. The obtained glass was pulverized with an alumina ball mill for 20 to 60 hours to obtain glass powder. In addition, ethanol was used as a solvent during pulverization.

[0081] The average particle diameter D of the glass powder for a protective layer obtained above was measured with a laser diffraction / scattering type particle size distribution analyzer (manufactured by Shimadzu Corporation (Shimadzu Corporation), trade name: SALD2100). 50 (μm). The average particle size (D 50 ) are all in the range of 1-3 μm.

[0082] Next, ...

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Abstract

To provide a substrate for mounting a light-emitting device, which is provided with a silver reflection layer having a high reflectance and being less susceptible to deterioration of the reflectance due to corrosion and which has an improved light extraction efficiency. A substrate for mounting a light-emitting element (1), which comprises a substrate main body (2), a silver reflection layer (6) composed mainly of silver or a silver alloy, formed on the substrate main body (2), and a protective layer formed so as to cover the entire surface of the silver reflection layer (6), wherein the protective layer (7) contains an alumina filler and further contains a glass constituting the protective layer (7), having silver ions diffused therein. The concentration of silver ions contained in the glass of the protective layer (7) is at least 0.5 mass% and at most 5.0 mass%.

Description

technical field [0001] The present invention relates to a substrate for mounting a light-emitting element, a manufacturing method thereof, and a light-emitting device, and particularly to a substrate for mounting a light-emitting element, a method for manufacturing a substrate for mounting a light-emitting element, and a method for using the same The light-emitting device is a substrate for mounting a light-emitting element. Background technique [0002] In recent years, light-emitting devices using light-emitting elements have been used as lighting, various displays, backlights for large liquid crystal televisions, and the like, as light-emitting elements such as light-emitting diodes (LEDs) have become brighter and whiter. Generally, a substrate for mounting a light-emitting element on which a light-emitting element is mounted is required to have high reflectivity capable of efficiently reflecting light emitted from the element. [0003] Therefore, currently, it is attemp...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/48H01L33/00
CPCH01L33/486H01L33/641H01L2224/48091H01L2224/48227H01L2924/181H01L33/60H01L2924/00014H01L2924/00012H01L33/48
Inventor 太田诚吾
Owner AGC INC
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