High-temperature-resistant antistatic adhesive tape and preparation method thereof

An anti-static, high-temperature-resistant technology, applied in the direction of adhesives, film/sheet adhesives, etc., can solve the problems of reducing the transparency of the cohesive strength tape, failing to play the role of anti-static, affecting the performance of adhesives, etc., to achieve excellent No adhesive residue after peeling, good antistatic effect, and no adhesive residue

Inactive Publication Date: 2012-02-15
NINGBO SOKEN CHEM
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Problems solved by technology

[0003] At present, some high-temperature resistant antistatic tapes on the market still have the following problems: (1) Introduce ionic additives into the interlayer between the adhesive layer and the substrate, and its electrostatic conductivity mainly depends on the humidity in the environment. In a high-temperature environment, it will not be able to Play a normal antistatic effect; (2) Introduce ionic additives into the adhesive layer, because these ionic additives will be in direct c

Method used

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  • High-temperature-resistant antistatic adhesive tape and preparation method thereof
  • High-temperature-resistant antistatic adhesive tape and preparation method thereof
  • High-temperature-resistant antistatic adhesive tape and preparation method thereof

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[0029] The present invention will be further described in detail below in conjunction with the embodiments.

[0030] The preparation method of protective tape includes the following steps:

[0031] ① Use one of PET, PI, PEN as the substrate, and corona on the surface of the substrate to make the surface tension of the substrate ≥46 dyne. The corona conditions are preferably as follows: corona power 1.0KW~2.0KW, running speed 10m / min;

[0032] ②Coat the conductive layer mixture on one side of a 50-micron thick substrate (one of PET, PI, PEN) with a screen printing roller, and dry it in an oven with a length of 30m, a coating speed of 50m / min, and the highest oven The temperature is 130℃, and the coating thickness is controlled within 0.1-0.5 microns;

[0033] ③Then coat the acrylate adhesive on the conductive layer, enter the oven for drying and pre-curing, the maximum temperature of the oven is 110℃, the thickness of the glue is 5-10 microns, the coating speed is 35m / min, and the ta...

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Abstract

The invention relates to a high-temperature-resistant antistatic adhesive tape which comprises a substrate layer and an adhesive layer, wherein a conducting layer is arranged between the substrate layer and the adhesive layer; the adhesive layer adopts an acrylate adhesive; and the hardener adopts an epoxy hardener/isocyanate hardener mixed hardener. The invention also relates to a preparation method of the adhesive tape. Compared with the prior art, the invention has favorable high-temperature-resistant and antistatic functions; and the conducting layer is positioned between the adhesive layer and the substrate, thereby preventing the ionic additive from transferring to the PI surface to cause pollution.

Description

technical field [0001] The invention relates to an adhesive tape, in particular to an adhesive tape with high temperature resistance and antistatic function. The invention also relates to a preparation method of the adhesive tape, which can be applied in the preparation process of integrated circuit boards. Background technique [0002] With the rapid development of electronic technology, the gradual reduction of the physical size of integrated circuits, the continuous improvement of integration, and the widespread use of more new polymer materials, electrostatic discharge has become increasingly important, and the problem of electrostatic protection has become more and more important. for widespread attention. So far, the FPC (abbreviation: flexible circuit board) manufacturing process is almost all processed by subtractive method (etching method). Usually, copper clad board is used as the starting material, and the resist layer is formed by photolithography, and the unnece...

Claims

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Application Information

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IPC IPC(8): C09J7/02C09J133/00C08L65/00C08L25/00C08L75/04C08L33/04
Inventor 向如亭
Owner NINGBO SOKEN CHEM
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