High-temperature-resistant antistatic adhesive tape and preparation method thereof

Abstract

The invention relates to a high-temperature-resistant antistatic adhesive tape which comprises a substrate layer and an adhesive layer, wherein a conducting layer is arranged between the substrate layer and the adhesive layer; the adhesive layer adopts an acrylate adhesive; and the hardener adopts an epoxy hardener / isocyanate hardener mixed hardener. The invention also relates to a preparation method of the adhesive tape. Compared with the prior art, the invention has favorable high-temperature-resistant and antistatic functions; and the conducting layer is positioned between the adhesive layer and the substrate, thereby preventing the ionic additive from transferring to the PI surface to cause pollution.

Description

technical field [0001] The invention relates to an adhesive tape, in particular to an adhesive tape with high temperature resistance and antistatic function. The invention also relates to a preparation method of the adhesive tape, which can be applied in the preparation process of integrated circuit boards. Background technique [0002] With the rapid development of electronic technology, the gradual reduction of the physical size of integrated circuits, the continuous improvement of integration, and the widespread use of more new polymer materials, electrostatic discharge has become increasingly important, and the problem of electrostatic protection has become more and more important. for widespread attention. So far, the FPC (abbreviation: flexible circuit board) manufacturing process is almost all processed by subtractive method (etching method). Usually, copper clad board is used as the starting material, and the resist layer is formed by photolithography, and the unnece...

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Problems solved by technology

[0003] At present, some high-temperature resistant antistatic tapes on the market still have the following problems: (1) Introduce ionic additives into the interlayer between the adhesive layer and the substrate, and its electrostatic conductivity mainly depends on the humidity in the environment. In a high-temperature environment, it will not be able to Play a normal antistatic effect; (2) Introduce ionic additives into the adhesive layer, because these ionic additives will be in direct contact with the PI surface, and there is a risk of migrating from the adhesive layer to the adhesive layer surface and transferred to the PI surface, Contaminate the PI surface; (3) Introduce conductive metal particles or polymer particles into the adhesive. Although it can maintain the static conductive function itself, due to the introduction of these conductive particles, some properties of the adhesive itself will be affected. Such as reducing cohesive strength, tape transparency, etc.

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