High-temperature-resisting type UV-LED (Ultraviolet-Light Emitting Diode) inkjet printing solder-resisting ink as well as preparation method and application thereof

A UV-LED, inkjet printing technology, used in applications, inks, household appliances, etc., to achieve high hardness, good high temperature resistance, good acid and alkali resistance

Active Publication Date: 2018-08-03
江门市阪桥电子材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] There is no UV-LED inkjet printing solder resist ink used in high temperature places in the prior art, and t

Method used

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  • High-temperature-resisting type UV-LED (Ultraviolet-Light Emitting Diode) inkjet printing solder-resisting ink as well as preparation method and application thereof
  • High-temperature-resisting type UV-LED (Ultraviolet-Light Emitting Diode) inkjet printing solder-resisting ink as well as preparation method and application thereof
  • High-temperature-resisting type UV-LED (Ultraviolet-Light Emitting Diode) inkjet printing solder-resisting ink as well as preparation method and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Example

[0069] Examples 1~6 and Comparative Examples 1~3

[0070] The usage amount of the raw materials of Examples 1 to 6 calculated in parts by mass is shown in Table 1;

[0071] The usage amount of the raw materials of Comparative Examples 1-7 calculated by mass parts is shown in Table 2.

[0072] The preparation method of the above-mentioned high temperature resistant UV-LED inkjet printing solder mask ink is as follows:

[0073] S1. Stir the phenolic epoxy resin, light-curing acrylic resin, phenolic resin, benzoxazine resin, and nano-color paste at a speed of 1000r / min for 1 hour and mix uniformly, for later use;

[0074] S2. Dissolve the photoinitiator in the active diluent, mix well, and set aside;

[0075] S3. Mix the mixture of resin and color paste, curing agent, photoinitiator-dissolved monomer, and additives, stir at 1000r / min for 1h, and filter through a 1 micron filter membrane to obtain a green high-temperature resistant UV -LED inkjet printing solder mask ink.

[0076] The high-t...

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Abstract

The invention discloses high-temperature-resisting type UV-LED (Ultraviolet-Light Emitting Diode) inkjet printing solder-resisting ink as well as a preparation method and application thereof. The high-temperature-resisting type UV-LED inkjet printing solder-resisting ink is prepared from the following components in parts by mass: 2 to 10 parts of phenolic epoxy resin, 2 to 10 parts of photo-curingacrylic resin, 1 to 5 parts of first phenolic resin, 1 to 5 parts of second phenolic resin, 1 to 4 parts of curing agent, 40 to 80 parts of active diluting agent, 3 to 10 parts of nano color paste, 3to 10 parts of photoinitiator and 0.1 to 1 part of auxiliary agent; the second phenolic resin is benzoxazine resin; the first phenolic resin is other phenolic resin except the benzoxazine resin; themass ratio of the phenolic epoxy resin to the first phenolic resin to the second phenolic resin is 2 to (0.5 to 1.5) to (0.5 to 1.5). The high-temperature-resisting type UV-LED inkjet printing solder-resisting ink provided by the invention has good high-temperature-resisting performance, good adhesive force, good acid and alkali resistance, good heat impact resistance, high rigidity and the like.

Description

technical field [0001] The invention relates to the technical field of solder resist ink for printed circuit boards, and more specifically, to a high temperature resistant UV-LED inkjet printing solder resist ink and its preparation method and application. Background technique [0002] Printed circuit board (PCB) is the support body of electronic components and the carrier of electrical connection of electronic components. In the production process of printed circuit boards, in order to protect the non-soldered parts from being damaged, the protection of solder resist ink is required at this time. [0003] Traditional printed circuit board solder resist inks are mainly dry film forming, thermal curing forming, ultraviolet (UV) curing forming and photoimaging curing forming. UV curing molding is widely used because of its fast curing speed, no solvent or less solvent used, and high line precision. At present, the process of printing circuit board solder resist ink is genera...

Claims

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Application Information

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IPC IPC(8): C09D11/30C09D11/322
CPCC09D11/30C09D11/322
Inventor 钟远波梁智昊封亮廷
Owner 江门市阪桥电子材料有限公司
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