Hydantoin epoxy resin composite for encapsulating semiconductor devices

A technology of hydantoin epoxy resin and epoxy resin, which is applied in the direction of semiconductor devices, semiconductor/solid-state device parts, electric solid-state devices, etc., can solve problems that have not been seen, and achieve good manufacturability and excellent dielectric strength Effect

Inactive Publication Date: 2012-03-14
北京中新泰合电子材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, the heterocyclic hydantoin epoxy resin can be used as an adhesive to prepare a high-voltage resistant epoxy resin compos

Method used

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  • Hydantoin epoxy resin composite for encapsulating semiconductor devices
  • Hydantoin epoxy resin composite for encapsulating semiconductor devices
  • Hydantoin epoxy resin composite for encapsulating semiconductor devices

Examples

Experimental program
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Example Embodiment

[0040] The preparation method of the present invention is to combine heterocyclic hydantoin epoxy resin, mixed acid anhydride, fused silica powder, composite metal hydroxide flame retardant, accelerator TPP, carnauba wax, carbon black, double The coupling agent is mixed in a double-roll plastic mill at 80-100°C, cooled and pulverized.

[0041] The epoxy resin composition of the present invention can be used as a packaging material for high-voltage resistant components and integrated circuits, and has excellent dielectric strength and high temperature resistance. Compared with bisphenol A epoxy and o-cresol epoxy resin composition, the dielectric strength is about 30-60% higher, and at the same time, it has good manufacturability and is suitable for the packaging of high-voltage resistant components.

Example Embodiment

[0043] Example A:

[0044] Heterocyclic hydantoin epoxy resin adopts MHR-018 and MHR-154 purchased from Wuxi Meihua Chemical Company and is mixed by weight at a ratio of 1:1 (MHR-018 epoxy value 0.15-0.2, softening point 88℃; MHR-154 ring Oxygen value 0.52-0.55, softening point 15℃) 100 parts, mixed acid anhydride (trimellitic anhydride and methyl nadic anhydride mixed by weight 7:3) 45 parts, accelerator TPP 1 part, fused silica 350 parts, silane coupling agent (KH560) 2 parts, carnauba wax 3 parts, carbon black 2 parts, the above raw materials are uniformly mixed in a two-roll rubber mixer at a mixing temperature of 80-100°C, and after mixing, they are cooled and crushed to prepare sample powder.

Example Embodiment

[0045] Example B:

[0046] The selected components are 30 parts except mixed acid anhydride (trimellitic anhydride and tetrahydrophthalic anhydride are mixed by weight 8:2), the accelerator is 1 part 2-phenyl-4-methylimidazole, and the other components are the same as in Example A The same, the preparation method is the same as in Example A.

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Abstract

The invention provides a hydantoin epoxy resin composite for encapsulating semiconductor devices, which is composed by heterocycle type hydantoin epoxy resin, anhydride curing agent, melting silica powder, flame retardant, accelerant and other ingredients. The curing product has excellent dielectric strength and high temperature resistance. The epoxy resin composite has the dielectric strength of 26-28Kv/mm, belongs to the halogen-free environmental-friendly type, and can be widely applied in encapsulating high pressure-resistant and high temperature-resistant semiconductor devices.

Description

technical field [0001] The present invention relates to an epoxy resin composition, more specifically, to an epoxy resin composition using heterocyclic hydantoin resin as a binder; [0002] The present invention also relates to a preparation method of the above-mentioned hydantoin epoxy resin composition. [0003] The present invention also relates to the application of the above hydantoin epoxy resin composition. Background technique [0004] As a resin composition used for encapsulating semiconductor components and integrated circuits, its cured product must have good electrical insulation properties. In general, the general use requirements can be basically met by using epoxy resins such as o-cresol novolac epoxy resins, alicyclic epoxy resins, bisphenol A epoxy resins and different curing agents. [0005] However, for the packaging of high-voltage components or integrated circuits, it is difficult for ordinary epoxy resin compositions to meet the electrical performance...

Claims

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Application Information

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IPC IPC(8): C08L63/00C08G59/42C08K13/02C08K3/34C08K3/22C08K3/04H01L23/29
Inventor 王金红赵秀芹汤银海王成杨东辉孙忠贤
Owner 北京中新泰合电子材料科技有限公司
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