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Hydantoin epoxy resin composite for encapsulating semiconductor devices

A technology of hydantoin epoxy resin and epoxy resin, which is applied in the direction of semiconductor devices, semiconductor/solid-state device parts, electric solid-state devices, etc., can solve problems that have not been seen, and achieve good manufacturability and excellent dielectric strength Effect

Inactive Publication Date: 2012-03-14
北京中新泰合电子材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, the heterocyclic hydantoin epoxy resin can be used as an adhesive to prepare a high-voltage resistant epoxy resin composition for semiconductor device packaging, and there is no report on the preparation of molding compounds from hydantoin epoxy resin

Method used

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  • Hydantoin epoxy resin composite for encapsulating semiconductor devices
  • Hydantoin epoxy resin composite for encapsulating semiconductor devices
  • Hydantoin epoxy resin composite for encapsulating semiconductor devices

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preparation example Construction

[0040] The preparation method of the present invention is to mix heterocyclic hydantoin epoxy resin, mixed acid anhydride, molten silicon powder, composite metal hydroxide flame retardant, accelerator TPP, carnauba wax, carbon black, The joint agent is put into a double-roller plastic mill, mixed at 80-100°C, cooled and pulverized.

[0041] The epoxy resin composition of the invention can be used as packaging material for high-voltage components and integrated circuits, and has excellent dielectric strength and high-temperature resistance. The dielectric strength is about 30-60% higher than that of bisphenol A epoxy and o-cresol novolac epoxy resin composition, and has good manufacturability at the same time, and is suitable for the packaging of high-voltage resistant components.

Embodiment A

[0044] The heterocyclic hydantoin epoxy resin was mixed with MHR-018 and MHR-154 purchased from Wuxi Meihua Chemical Co. Oxygen value 0.52-0.55, softening point 15°C) 100 parts, mixed anhydride (trimellitic anhydride and methylnadic anhydride mixed by weight 7:3) 45 parts, accelerator TPP 1 part, molten silicon powder 350 parts, silane coupling agent (KH560) 2 parts, carnauba wax 3 parts, carbon black 2 parts, the above raw materials were mixed evenly in a double-roller rubber mixer, the mixing temperature was 80-100 ° C, after mixing, cooled and pulverized to make a sample powder.

Embodiment B

[0046] The selected components except mixed acid anhydride (trimellitic anhydride and tetrahydrophthalic anhydride mixed by weight 8:2) are 30 parts, 1 part of accelerator 2-phenyl-4-methylimidazole, and other components are the same as those in Example A Identical, its preparation method is also identical with embodiment A.

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Abstract

The invention provides a hydantoin epoxy resin composite for encapsulating semiconductor devices, which is composed by heterocycle type hydantoin epoxy resin, anhydride curing agent, melting silica powder, flame retardant, accelerant and other ingredients. The curing product has excellent dielectric strength and high temperature resistance. The epoxy resin composite has the dielectric strength of 26-28Kv / mm, belongs to the halogen-free environmental-friendly type, and can be widely applied in encapsulating high pressure-resistant and high temperature-resistant semiconductor devices.

Description

technical field [0001] The present invention relates to an epoxy resin composition, more specifically, to an epoxy resin composition using heterocyclic hydantoin resin as a binder; [0002] The present invention also relates to a preparation method of the above-mentioned hydantoin epoxy resin composition. [0003] The present invention also relates to the application of the above hydantoin epoxy resin composition. Background technique [0004] As a resin composition used for encapsulating semiconductor components and integrated circuits, its cured product must have good electrical insulation properties. In general, the general use requirements can be basically met by using epoxy resins such as o-cresol novolac epoxy resins, alicyclic epoxy resins, bisphenol A epoxy resins and different curing agents. [0005] However, for the packaging of high-voltage components or integrated circuits, it is difficult for ordinary epoxy resin compositions to meet the electrical performance...

Claims

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Application Information

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IPC IPC(8): C08L63/00C08G59/42C08K13/02C08K3/34C08K3/22C08K3/04H01L23/29
Inventor 王金红赵秀芹汤银海王成杨东辉孙忠贤
Owner 北京中新泰合电子材料科技有限公司
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