Bismuth telluride-based thermoelectric material and preparation method thereof
A technology of thermoelectric materials and raw materials, applied in the direction of thermoelectric device lead-out wire materials, thermoelectric device manufacturing/processing, etc., can solve the problems of easy damage of nanostructures, limited development of thermoelectric materials, difficult processing, etc., and achieve thermoelectric performance Outstanding, high density, simple preparation technology
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Embodiment 1
[0014] Embodiment 1: one-step synthetic method synthesizes Bi 38-x (InSb) x Te 62
[0015] The optional elemental raw materials can be selected according to Bi 38-x (InSb) x Te 62 (0.6≤x≤0.8) chemical formula content weighing. Put it into a sintered flat quartz tube at the bottom for vacuum line sealing, then put it vertically into a muffle furnace, sinter at 780°C for 2 to 3 days, and then slowly cool down to 530°C to obtain Bi 38-x (InSb) x Te 62 .
Embodiment 2
[0016] Example 2: Cutting and polishing sample Bi 38-x (InSb) x Te 62 Perform thermoelectric performance test
[0017] The Bi prepared by the above method 38-x (InSb) x Te 62 Block samples were cut with a diamond cutter and then sanded. The sample is first cut into basic discs and cuboid samples with a cutting machine, and then polished with sandpaper; the thickness of the disc sample is 1.93mm, and the diameter is 10.17mm. The cross-sectional area of the cuboid is 2.16 × 2.16 mm 2 , The thermal diffusivity of the wafer was tested on a Netzsch LFA457 device, using pyrocream 9606 as a standard sample, and tested under an argon atmosphere. The electrical conductivity and Seebeck coefficient were tested on ULVAC ZEM-3.
Embodiment 3
[0018] Embodiment 3: Sample Bi 38-x (InSb) x Te 62 The thermoelectric performance test results of
[0019] The above test results show that the resistivity increases with the increase of temperature, from 8.03*10 at room temperature -6 Ω m increases to 9.99*10 at 447K -6 Ωm. The absolute value of the Seebeck coefficient first increases with the increase of temperature, reaches a maximum of 234μV / K at 323K, and then decreases. A negative Seebeck coefficient indicates that Bi 38-δ (InSb) δ Te 62 Most of the carriers are electrons. The thermal conductivity increases with the increase of temperature, and the thermal conductivity near room temperature is 1.9W / m.K. According to the thermoelectric figure of merit formula: Z=S 2 σ / K, where S is the Seebeck coefficient of the material, σ is the electrical conductivity, K is the thermal conductivity, and Bi can be obtained 38-x (InSb) x Te 62 The ZT value of the sample is 1.108 at 323K.
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