Electric connector and manufacturing method thereof

Abstract

The invention discloses an electric connector and a manufacturing method thereof. The method is characterized by comprising the following steps: arranging a baffle frame at the outer periphery of each terminal on an electric conduction plate after the terminals are fixed on the whole electric conduction plate; pouring liquids or pasty insulation materials in a space defined by the electric conduction plate and the baffle frame; and finally removing the redundant part on the electric conduction plate, so that the electric conduction plate forms a plurality of isolated electric conduction blocks which are in one-to-one correspondence with the terminals. Through the manufacturing method, not only can the insertion force problem brought by the assembling method be avoided, but also the problem of bending difficulty of a material strip brought by the mode of insert-molding can be solved; the intensity required by the electric connector can be ensured by the electric conduction plate selected in the manufacturing method, at the same time, the thickness can be reduced, thus the thickness of the manufactured electric connector is smaller, which accords with the development trend of an ultrathin electric connector, and the mode that all the terminals are fixed into a mutually-conducted integrity and the integrity is then separated into isolated individuals ensures that short circuit hazard can not happen among the terminals.

Description

technical field [0001] The invention relates to an electrical connector and a manufacturing method thereof, in particular to a high-density electrical connector and a manufacturing method thereof. Background technique [0002] At present, for electrical connectors used to electrically connect a chip module to an external circuit board, the industry usually adopts an assembly method to manufacture, that is, first use LCP (Liquid Crystal Polyester) material to injection mold an insulating body with multiple receiving holes , and then use the tape to insert the terminals into the receiving holes of the insulating body in batches, and finally break the tape. In this method, due to the frictional resistance between the wall of the receiving hole and the terminal, it is difficult to insert the terminal, and for high-density connectors, due to the large number of receiving holes formed on the insulating body and the dense arrangement of the receiving holes, it is easy to cause the ...

AI Technical Summary

Problems solved by technology

Since the circuit board includes a resin substrate and contact pads located on the upper and lower surfaces, its thickness is relatively large, which cannot meet the development trend of ultra-thin electrical connectors, and due to the dense arrangement of terminals, the solder tends to spread around during the soldering process. Coating the welding ends of adjacent terminals leads to the risk of short circuit in the manufactured electrical connector. Similarly, the arrangement of through holes on the circuit board is correspondingly dense, resulting in weak circuit board strength

Images