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Low-temperature foaming phenolic resin, preparation method thereof and preparation method of modified phenolic foam

A technology of foaming phenolic resin and low temperature, which is applied in the field of modified phenolic foam, which can solve problems such as environmental pollution and difficult production control, and achieve the effects of stable process, beautiful appearance and cost reduction

Inactive Publication Date: 2012-05-09
王博
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Both of these existing technologies use liquid formaldehyde as a raw material, and vacuum dehydration is required. The production is not easy to control, and a large amount of phenol-containing wastewater will be produced, causing environmental pollution.

Method used

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  • Low-temperature foaming phenolic resin, preparation method thereof and preparation method of modified phenolic foam
  • Low-temperature foaming phenolic resin, preparation method thereof and preparation method of modified phenolic foam

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] (1) Preparation of low-temperature foaming phenolic resin

[0027] Add 800 kilograms of phenol and 15 kilograms of 30% (weight percent) sodium hydroxide into a 2 ton reaction kettle, stir, heat to 80°C, add 320 kilograms of paraformaldehyde in 6 times, react for 30 minutes, and heat up to 90~ React at 95°C for 30 minutes, then lower the temperature to 85°C, add 10 kg of urea, react for 50 minutes, and lower the temperature to room temperature to obtain a low-temperature foaming phenolic resin with a viscosity of 2000CP / 25°C.

[0028] (2) Preparation of modified phenolic foam

[0029] Combine 100 parts of low-temperature foaming phenolic resin prepared in (1) (parts by weight, the same below) and 4 parts of Tween 80, 6 parts of petroleum ether, 3 parts of ethanol, 3 parts of modified rubber powder, stir well and add 9 parts Benzene sulfonic acid is stirred at room temperature for 20 seconds and then injected into the mold cavity, and cured for 2 minutes to obtain modified phen...

Embodiment 2

[0031] Add 100 parts of low-temperature foaming phenolic resin prepared in (1), H3302 parts of silicone oil, 4 parts of n-pentane, 3 parts of ethanol, and 3 parts of modified rubber powder. After stirring, add 11 parts of benzenesulfonic acid and stir for 2 minutes. After being injected into the cavity for 5 minutes, a modified phenolic foam board and products with excellent curing are obtained.

Embodiment 3

[0033] Add 100 parts of low-temperature foaming phenolic resin prepared in (1), DC-1934 parts of silicone oil, 5 parts of ethanol, 9 parts of n-pentane, and 6 parts of modified rubber powder. After stirring, add 3 parts of xylene sulfonic acid and 7 parts of toluenesulfonic acid, stirred for 5 minutes and injected into the mold cavity for 3 minutes to obtain a modified phenolic foam board and products with excellent curing.

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Abstract

The invention discloses a low-temperature foaming phenolic resin which is prepared from the following components in parts by weight: 100 parts of phenol, 40-65 parts of paraformaldehyde, 0.5-3.5 parts of catalyst and 1-6 parts of amine compound. In addition, the invention also discloses a preparation method of the low-temperature foaming phenolic resin and a preparation method of modified phenolic foam of the low-temperature foaming phenolic resin. The low-temperature foaming phenolic resin can foam at 5-25 degrees; and the modified phenolic foam prepared from the low-temperature foaming phenolic resin is applicable to the low-temperature one-step molding technology, and has the advantages of short curing time and high production efficiency.

Description

Technical field [0001] The invention relates to a low-temperature foaming phenolic resin, a preparation method thereof and a method for modifying phenolic foam. Background technique [0002] The foam insulation material produced by phenolic resin has the characteristics of low thermal conductivity, non-combustibility, low smoke toxicity, and low cost. Phenolic foam has a history of many years and is the best fireproof of insulation foam. Despite these advantages, phenolic foam has not been widely used in the insulation market. The main reason is that phenolic resin must be heated to obtain an ideal cured phenolic foam. This method has high energy consumption, complicated processing, low efficiency, and The product is brittle and frothy, which limits its promotion and application. [0003] For this reason, Chinese Patent Application No. 03106510 (title of invention: production method of phenolic resin used for continuous casting and foaming at room temperature and the prepared resi...

Claims

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Application Information

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IPC IPC(8): C08G14/08C08J9/04
Inventor 王博
Owner 王博
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