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Carbide composite phase change storage material and preparation method thereof

A technology of composite phase change and storage materials, applied in the field of carbide composite phase change storage materials and preparation, can solve the problems of large current, hinder the market promotion of phase change memory, long time required, etc. Effect of grain size reduction and grain boundary increase

Active Publication Date: 2013-07-31
SHANGHAI INST OF MICROSYSTEM & INFORMATION TECH CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the main phase change material of the phase change memory also has some defects, such as the long time required for the transformation from the amorphous state to the crystal state, and the excessive current required to transform the crystal state into the amorphous state.
It is these deficiencies that hinder the promotion of phase change memory to the market

Method used

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  • Carbide composite phase change storage material and preparation method thereof
  • Carbide composite phase change storage material and preparation method thereof
  • Carbide composite phase change storage material and preparation method thereof

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Embodiment Construction

[0020] Preferred embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings.

[0021] In this embodiment, silicon carbide (SiC) is used as the doped carbide, and the phase change material is Sb 2 Te 3 As an example, the specific components of the carbide composite phase change storage material are

[0022] (Sb 2 Te 3 ) x (SiC) 100-x , wherein 50≤x≤95, that is, the molar percentage of silicon carbide in the carbide composite phase change material is 5%-50%.

[0023] (Sb 2 Te 3 ) x (SiC) 100-x by Sb 2 Te 3 The target and the SiC target are co-sputtered. The specific experimental conditions are: the sputtering body is argon, and the background vacuum is less than 10 -4 Pa, sputtering pressure is 0.21Pa~0.22pa, sputtering power supply: Sb 2 Te 3 RF power is used, SiC uses RF power, and the deposition thickness is 50-200nm.

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Abstract

The invention discloses a carbide composite phase change storage material, which is formed by carbide and phase change materials through compounding. The carbide has the effect of separating the phase change materials into nanometer level island regions, so the growth of the phase change materials is inhibited by the carbide, the grain boundary number is greatly increased, the resistivity of composite materials is improved, and the composite materials have good phase change characteristic and thermal stability. In addition, the amorphous resistance value of the phase change materials can be regulated through a method of improving the carbide proportion, and the problem of excessive threshold current or excessive power consumption caused by too low amorphous resistance is solved.

Description

technical field [0001] The invention relates to a phase-change storage material and a preparation method, in particular to a carbide composite phase-change storage material and a preparation method, and belongs to the related field of semiconductor memory. Background technique [0002] In 1968, Stanford R. Ovshinsky first reported in the article of Physical Review Letters that in chalcogenides (Ge 10 Si 12 As 30 Te 48 ) found a transition phenomenon between high and low resistance values ​​excited by an electric field. However, it is only in the last ten years that chalcogenides have been really applied to electrical storage devices. This is all due to the development of the microelectronics industry in recent years, which provides a technical premise for the realization of electrical storage devices, because only in the micron or even nanometer In the case of scale, the power consumption required for the phase transition of chalcogenide materials can be greatly reduced,...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C22C32/00C23C14/34C23C14/06
Inventor 吴良才朱敏宋志棠
Owner SHANGHAI INST OF MICROSYSTEM & INFORMATION TECH CHINESE ACAD OF SCI
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