Semiconductor device, active matrix substrate, and display device
A semiconductor and substrate technology, applied in the field of active matrix substrates and display devices, can solve problems such as flow and achieve the effect of reducing leakage current
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no. 1 Embodiment approach
[0072] figure 1 It is a cross-sectional view showing the configuration of the liquid crystal display device of the first embodiment. exist figure 1 Among them, the liquid crystal display device 1 has: figure 1 The upper side is the liquid crystal panel 2 on the visual recognition side (display surface side); and the backlight unit 3 is disposed on the non-display surface side of the liquid crystal panel 2 ( figure 1 The lower side of the liquid crystal panel 2 is irradiated with illumination light.
[0073] The liquid crystal panel 2 is provided with: a color filter substrate 4 and an active matrix substrate 5, which constitute a pair of substrates; . A liquid crystal layer (not shown) is provided between the color filter substrate 4 and the active matrix substrate 5 . In addition, for the color filter substrate 4 and the active matrix substrate 5 , a flat transparent glass material or a transparent synthetic resin such as acrylic resin is used. Resin films such as TAC (...
no. 2 Embodiment approach
[0128] Figure 8 It is a plan view showing a schematic configuration of a main part of a switch unit according to the second embodiment. Figure 9 yes Figure 8 IX-IX line sectional view in. In the drawings, the main difference between the present embodiment and the above-mentioned first embodiment is that the bottom gate electrode is formed not in a rectangular shape but in a comb-tooth shape. In addition, the same code|symbol is attached|subjected to the element common to the said 1st Embodiment, and overlapping description is abbreviate|omitted.
[0129] That is, if Figure 8 As shown, in the switch portion 18 of the present embodiment, the bottom gate electrode 37 is formed in a comb-tooth shape, and is provided in the carrier generation region (depletion region, that is, the drain junction portion) in the silicon layer SL that generates light leakage current. nearby area).
[0130] Specifically, such as Figure 9 As shown, the bottom gate electrode 37 is divided int...
no. 3 Embodiment approach
[0135] Figure 10 It is a circuit diagram showing the equivalent circuit of the switch part of 3rd Embodiment. Figure 11 is showing Figure 10 A plan view showing a schematic configuration of the main parts of the switch unit shown. Figure 12 (a) and Figure 12 (b) respectively Figure 11 The XIIa-XIIa line sectional view and the XIIb-XIIb line sectional view. In the figure, the main difference between the present embodiment and the above-mentioned first embodiment is that, with respect to a thin film transistor having a top gate electrode (main gate electrode) and a bottom gate electrode (auxiliary gate electrode), series connection A thin film transistor having only a top gate electrode (transistor of top gate structure). In addition, the same code|symbol is attached|subjected to the element common to the said 1st Embodiment, and overlapping description is abbreviate|omitted.
[0136] That is, if Figure 10 As shown, in the switch unit 18 of this embodiment, only th...
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