Preparation method of doped graphene and application of doped graphene
A technology of graphene and doping elements, which is applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve the problems of low performance index of doped graphene, complex process conditions, unsuitable for industrialization, etc. The effect of large-scale industrial production, few structural defects, and large market potential value
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Embodiment 1
[0045] Embodiment 1 prepares nitrogen-doped graphene
[0046] 1) Defects:
[0047] ion implantation method
[0048] Step 1: Graphene prepared by mechanical exfoliation (flaky graphite purchased by alfa aesar), chemical vapor deposition or SiC epitaxy (references: [1] Controllable N-doping ofgraphene.DOI: 10.1021 / nl103079j; [2] ]Synthesis of N-Doped Graphene by Chemical Vapor Deposition and Its Electrical Properties. Nano Lett., Vol.9, No.5, 2009; [3] Raman spectrum of epitaxial graphene on SiC (0001), Doi: 10.1063 / 1.2929746) Enter the vacuum chamber of the ion implanter (model: LC-16, production / development unit: the 48th Research Institute of China Electronics Technology Group). Then vacuum, the vacuum degree reaches 10 -4 MPa or higher. figure 1 is the AFM image of graphene prepared by mechanical exfoliation; the Raman spectrum of graphene before ion implantation is shown as figure 2 -a shown.
[0049] Step 2: Setting parameters: Ion type: N + 、Ar + One of them or...
Embodiment 2
[0053] Embodiment 2 prepares boron doped graphene
[0054] 1) Defects:
[0055] plasma method
[0056] Step 1: Graphene prepared by mechanical exfoliation (flaky graphite purchased by alfa aesar), chemical vapor deposition or SiC epitaxy (references: [1] Controllable N-doping ofgraphene.DOI: 10.1021 / nl103079j; [2] ]Synthesis of N-Doped Graphene by Chemical Vapor Deposition and Its Electrical Properties. Nano Lett., Vol.9, No.5, 2009; [3] Raman spectrum of epitaxial graphene on SiC (0001), Doi: 10.1063 / 1.2929746) Into the vacuum chamber of the plasma machine (PS 300SA plasma system, Pfatetop, Germany) or plasma reactive etching equipment (JPCD-300, Beijing Techno Technology Co., Ltd.). Vacuum to 10 -4 MPa.
[0057] Step 2: Set parameters: one or any combination of oxygen, ammonia plasma, etc.;
[0058] Ion energy, 200eV ~ 400KeV; dose: 10 7 ~10 18 piece / cm -2
[0059] 2) Annealing:
[0060] Step 3: Put the defective graphene after plasma treatment in the annealing f...
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