Manufacturing process for printed circuit board

A printed circuit board and manufacturing process technology, applied in the direction of printed circuit manufacturing, printed circuits, and assembling printed circuits with electrical components

Inactive Publication Date: 2012-06-13
苏州日月明微电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

It is very promising to embed capacitors into the inner layer of PCB. It will play a key role in the trend of high frequency, high perfor

Method used

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Examples

Experimental program
Comparison scheme
Effect test

specific Embodiment approach 1

[0011] Specific implementation mode one, Step 1. Preparation of base material and negative film: (1) Before production, the light-painted negative film should be carefully inspected. For the 9"X 11" size film, use the OPTI LINE film punching machine to punch the inner film. The outer negative is to be reproduced as a diazo film. The 11"X 14" size board film adopts the L-shaped positioning method, and uses the C·A·PICARD punching equipment to punch the positioning holes. (2) Stick film. Attach the anti-corrosion dry film to the clean copper foil surface by hot pressing with a film sticking machine. (3) Substrate punching. After the substrate with the dry film has cooled, punch the 9"X 11" board with the ACCU.LINE substrate punch. The L-shaped positioning method omits this step. (4) Exposure. Adhere the negative on the film surface and expose it to transfer the pattern to the copper surface. (5) Development. The unexposed and cured dry film is removed by chemical method...

specific Embodiment approach 2

[0015] Specific implementation mode two, Step 1. Preparation of base material and negative film: (1) Before production, the light-painted negative film should be carefully inspected. For the 9"X 11" size film, use the OPTI LINE film punching machine to punch the inner film. The outer negative is to be reproduced as a diazo film. The 11"X 14" size board film uses the L-shaped positioning method, and uses the C·A·PICARD punching equipment to punch the positioning holes. (2) Stick film. Attach the anti-corrosion dry film to the clean copper foil surface by hot pressing with a film sticking machine. (3) Substrate punching. After the substrate with the dry film has cooled, punch the 9"X 11" board with the ACCU.LINE substrate punch. The L-shaped positioning method omits this step. (4) Exposure. Adhere the negative on the film surface and expose it to transfer the pattern to the copper surface. (5) Development. The unexposed and cured dry film is removed by chemical methods...

specific Embodiment approach 3

[0019] Specific implementation mode three, Step 1. Preparation of base material and negative film: (1) Before production, the light-painted negative film should be carefully inspected. For the 9"X 11" size film, use the OPTI LINE film punching machine to punch the inner film. The outer negative is to be reproduced as a diazo film. The 11"X 14" size board film uses the L-shaped positioning method, and uses the C·A·PICARD punching equipment to punch the positioning holes. (2) Stick film. Attach the anti-corrosion dry film to the clean copper foil surface by hot pressing with a film sticking machine. (3) Substrate punching. After the substrate with the dry film has cooled, punch the 9"X 11" board with the ACCU.LINE substrate punch. The L-shaped positioning method omits this step. (4) Exposure. Adhere the negative on the film surface and expose it to transfer the pattern to the copper surface. (5) Development. The unexposed and cured dry film is removed by chemical metho...

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PUM

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Abstract

The invention discloses a manufacturing process for a printed circuit board, particularly the manufacturing process for a buried type capacitive printed circuit board. The manufacturing process comprises the following steps of: 1, preparation of a substrate and a bottom plate; 2, lamination; 3, drilling, desmearing and hole metallization; and 4, production of capacitance graphics, wherein the specific operation of the lamination in the step 2 comprises pre-pressing in a die, total pressure application, heat and pressure preservation, cold pressing and aftertreatment. By the process, the lamination step is optimized in the manufacture of the printed circuit board, so that the thermal stress of the circuit board is increased, and a finished product still can stay the same after being thermally shocked for many times. The performance of the product is improved, production steps are optimized, and a development basis is further provided for the development of the printed circuit board.

Description

technical field [0001] The invention relates to the technical field of automatic control, in particular to a manufacturing process of an embedded capacitor printed circuit board. Background technique [0002] The embedded capacitor printed circuit board is a kind of integrated component board (ICB). It was first proposed by Zycon, a PCB company in the United States, in 1992. However, at that time, due to the price and performance of SMT capacitors, it could adapt to the development of integrated circuit technology. Development, buried capacitors have not received special attention from the industry for a long time. With the advancement of electronic technology and the rapid development of PCB high density, embedded capacitors can effectively increase the interconnection density and performance of printed circuit boards, and have become an important aspect of the development of a new generation of HDI boards. [0003] Capacitance is the key to ensure the quality of PCB. Whe...

Claims

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Application Information

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IPC IPC(8): H05K3/00H05K3/30
Inventor 李明
Owner 苏州日月明微电子科技有限公司
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