The invention discloses a manufacturing process for a printed circuit board, particularly the manufacturing process for a buried type capacitive printed circuit board. The manufacturing process comprises the following steps of: 1, preparation of a substrate and a bottom plate; 2, lamination; 3, drilling, desmearing and hole metallization; and 4, production of capacitance graphics, wherein the specific operation of the lamination in the step 2 comprises pre-pressing in a die, total pressure application, heat and pressure preservation, cold pressing and aftertreatment. By the process, the lamination step is optimized in the manufacture of the printed circuit board, so that the thermal stress of the circuit board is increased, and a finished product still can stay the same after being thermally shocked for many times. The performance of the product is improved, production steps are optimized, and a development basis is further provided for the development of the printed circuit board.