Chemical analysis method for lead elements in tin-lead alloy solder

Abstract

The invention provides a chemical analysis method for lead elements in a tin-lead alloy solder. The chemical analysis method comprises the following steps of: A, accurately weighing a certain amount of tin-lead alloy solder samples into a beaker, adding nitric acid into the beaker, and putting the beaker on a heating plate for heating; after producing white smoke, adding hydrogen peroxide into the beaker for continuously heating until reaction is finished, adding hydrochloric acid for continuously heating until the samples are completely dissolved; B, adding a tartaric acid potassium sodium solution, deionized water and triethanolamine into the beaker after cooling; using a hexamethylene tetramine-ammonia water mixture to regulate the PH value of a test solution within the range of 5.5-6.0, dripping a xylenol orange indicator, and using an EDTA (Ethylene Diamine Tetraacetic Acid) standard titration solution for titrating until the mixture is stable luminous yellow; C, during test, carrying out a blank test; and D, calculating according to a formula to obtain the mass fraction of the lead elements in the tin-lead alloy solder. The method brings the beneficial effects that according to the method, the cost of measurement and analysis is effectively reduced, and the measurement accuracy is increased.

Description

technical field [0001] The invention relates to the field of material composition analysis, in particular to an analysis method for the content of lead element in tin-lead alloy solder. Background technique [0002] Tin-lead alloy solder has the characteristics of low melting point, good corrosion resistance, and good wettability to copper alloys, so it is widely used in the connection of electronic components and printed circuit boards, so as to realize circuit functions. [0003] Although it is the general trend to promote the development of lead-free electronic assembly and packaging in response to the requirements of environmental protection, suitable lead-free solders have not been developed in some specific fields, such as high-end solder used in servers, memories, microprocessors, etc. Tin-lead solder with melting point and high lead content cannot be replaced by lead-free solder, and it is still within the exemption clauses of EU directives and Chinese directives. T...

AI Technical Summary

Problems solved by technology

[0005] In order to solve the problem that the existing measuring method measures the lead element content in the tin-lead alloy solder, the result accuracy is low, the present invention proposes the following technical solutions:

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