Chemical analysis method for lead elements in tin-lead alloy solder

A tin-lead alloy and solder technology, which is applied in the direction of chemical reaction of materials and material analysis by observing the influence of chemical indicators, can solve the problems of low accuracy of results, improve measurement accuracy and reduce costs. Effect

Inactive Publication Date: 2012-06-20
苏州华碧微科检测技术有限公司
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Problems solved by technology

[0005] In order to solve the problem that the existing measuring method measures the lead element content in the t

Method used

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  • Chemical analysis method for lead elements in tin-lead alloy solder
  • Chemical analysis method for lead elements in tin-lead alloy solder
  • Chemical analysis method for lead elements in tin-lead alloy solder

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Embodiment Construction

[0020] The preferred embodiments of the present invention are described in detail below, so that the advantages and features of the present invention can be more easily understood by those skilled in the art, so as to define the protection scope of the present invention more clearly.

[0021] In this embodiment, the lead element content in a certain brand of tin-lead alloy solder sample is analyzed, and the method comprises the following steps:

[0022] A. Weigh 0.2000g of tin-lead alloy solder sample and place it in a beaker, add 10mL nitric acid into the beaker, place the beaker on a heating plate to heat at 102°C, after white smoke is generated, add 2mL hydrogen peroxide, continue heating until the reaction is over, then add 2mL hydrochloric acid, continue heating until the sample is completely dissolved;

[0023] B. After the beaker is cooled, add 5mL 100g / L potassium sodium tartrate solution, 40mL deionized water and 5mL triethanolamine (1+4) into the beaker, and use hexa...

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Abstract

The invention provides a chemical analysis method for lead elements in a tin-lead alloy solder. The chemical analysis method comprises the following steps of: A, accurately weighing a certain amount of tin-lead alloy solder samples into a beaker, adding nitric acid into the beaker, and putting the beaker on a heating plate for heating; after producing white smoke, adding hydrogen peroxide into the beaker for continuously heating until reaction is finished, adding hydrochloric acid for continuously heating until the samples are completely dissolved; B, adding a tartaric acid potassium sodium solution, deionized water and triethanolamine into the beaker after cooling; using a hexamethylene tetramine-ammonia water mixture to regulate the PH value of a test solution within the range of 5.5-6.0, dripping a xylenol orange indicator, and using an EDTA (Ethylene Diamine Tetraacetic Acid) standard titration solution for titrating until the mixture is stable luminous yellow; C, during test, carrying out a blank test; and D, calculating according to a formula to obtain the mass fraction of the lead elements in the tin-lead alloy solder. The method brings the beneficial effects that according to the method, the cost of measurement and analysis is effectively reduced, and the measurement accuracy is increased.

Description

technical field [0001] The invention relates to the field of material composition analysis, in particular to an analysis method for the content of lead element in tin-lead alloy solder. Background technique [0002] Tin-lead alloy solder has the characteristics of low melting point, good corrosion resistance, and good wettability to copper alloys, so it is widely used in the connection of electronic components and printed circuit boards, so as to realize circuit functions. [0003] Although it is the general trend to promote the development of lead-free electronic assembly and packaging in response to the requirements of environmental protection, suitable lead-free solders have not been developed in some specific fields, such as high-end solder used in servers, memories, microprocessors, etc. Tin-lead solder with melting point and high lead content cannot be replaced by lead-free solder, and it is still within the exemption clauses of EU directives and Chinese directives. T...

Claims

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Application Information

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IPC IPC(8): G01N21/79
Inventor 孙道元
Owner 苏州华碧微科检测技术有限公司
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