Preparation method of waste plastic composite material modified by waste circuit board non-metal powder

A waste circuit board and non-metallic powder technology, which is applied in the field of preparation of waste circuit board non-metal powder modified waste plastic composite materials, can solve the problems of environmental pollution, waste of useful resources, etc., to improve overall performance, ease processing pressure, Effect of improving interfacial bonding properties

Inactive Publication Date: 2012-06-27
TONGJI UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0002] At present, for the resource utilization of non-metallic materials in the process of waste circuit board disposal, there is still no effective economic means at home and abroad. A

Method used

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  • Preparation method of waste plastic composite material modified by waste circuit board non-metal powder
  • Preparation method of waste plastic composite material modified by waste circuit board non-metal powder

Examples

Experimental program
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Effect test

Embodiment 1

[0017] Example 1: Using water as the liquefaction solution and sulfuric acid as a catalyst, the non-metallic powder of the waste circuit board is activated by hydrothermal method to obtain the non-metallic powder of the waste circuit board activated by the hydrothermal method; The non-metallic powder of the waste circuit board and the reclaimed waste polyethylene are mixed and extruded in a parallel co-rotating twin-screw extruder to obtain a modified waste plastic composite material filled with the non-metal powder of the waste circuit board.

[0018] Step (1): Add 800mL of water and 80mL, 90% weight concentration sulfuric acid solution in the autoclave, stir with a glass rod for 10 minutes, then add 250g of dry waste circuit board non-metallic powder, stir and disperse with a glass rod for 30 Minutes later, treated at 180°C for 4 hours, diluted and washed with deionized water, filtered by filter membrane, washed repeatedly until the filtrate was neutral, and dried at 120°C fo...

Embodiment 2

[0023] Embodiment 2: Using water as the liquefaction solution and potassium hydroxide as the catalyst, the non-metallic powder of the waste circuit board is activated by hydrothermal method to obtain the non-metallic powder of the waste circuit board activated by the hydrothermal method; The activated waste circuit board non-metal powder and waste polypropylene reclaimed material are mixed and then extruded in a parallel co-rotating twin-screw extruder to obtain a waste circuit board non-metal powder filled modified waste plastic composite material.

[0024] Step (1): Add 900mL of water and 90g of potassium hydroxide into the autoclave, stir with a glass rod for 20 minutes, then add 300g of dry waste circuit board non-metallic powder, stir and disperse with a glass rod for 20 minutes, After treatment at 160°C for 6 hours, dilute and wash with deionized water, filter with filter membrane, wash repeatedly until the filtrate is neutral, and dry at 100°C for 6 hours to obtain non-m...

Embodiment 3

[0028] Example 3: Using water as the liquefaction solution and potassium carbonate as a catalyst, the non-metallic powder of the waste circuit board is activated by hydrothermal method to obtain the non-metallic powder of the waste circuit board activated by the hydrothermal method; then the above is activated by the hydrothermal method The waste circuit board non-metal powder and the waste polyvinyl chloride recycled material are mixed and then extruded in a parallel co-rotating twin-screw extruder to obtain a waste circuit board non-metal powder filled modified waste plastic composite material.

[0029] Step (1): Add 600mL of water and 60g of potassium carbonate in the autoclave, stir with a glass rod for 20 minutes, then add 200g of dry waste circuit board non-metallic powder, stir and disperse with a glass rod for 30 minutes, After being treated at 170°C for 5 hours, it was diluted and washed with deionized water, filtered by filter membrane, washed repeatedly until the fil...

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Abstract

The invention relates to a preparation method of a waste plastic composite material modified by waste circuit board non-metal powder. The preparation method disclosed by the invention comprises the following steps of: performing hydrothermal process activation treatment on the waste circuit board non-metal powder after drying to get the activated waste circuit board non-metal powder, further mixing the activated waste circuit board non-metal powder with a waste plastic recycled material, and then performing extrusion molding in a parallel co-rotating twin-screw extruder to get the waste plastic composite material modified by the waste circuit board non-metal powder. The preparation method disclosed by the invention is simple in process, and the hydrothermal process activation treatment isperformed on the waste circuit board non-metal powder, so that chemical bonds of the non-metal powder can be broken, new activation points are produced for producing new activation groups from the waste circuit board non-metal powder, the purpose of improving the bonding performance of the waste circuit board non-metal powder with an interface of a resin matrix can be achieved and the overall performance of the composite material can be improved. According to the preparation method disclosed by the invention, the waste circuit board non-metal powder and the waste plastic recycled material aretaken as raw materials, so that resource utilization of the waste materials is realized, the cost of the materials is simultaneously reduced, and great economic and social significance is further realized.

Description

technical field [0001] The invention belongs to the technical field of comprehensive utilization of solid waste, and in particular relates to a preparation method of a waste plastic composite material modified by non-metal powder of waste circuit boards. Background technique [0002] At present, for the resource utilization of non-metallic materials in the process of waste circuit board disposal, there is still no effective economic means at home and abroad. A large part of non-metallic materials are discarded, incinerated or buried as garbage, which not only causes serious environmental pollution , and lead to a large waste of useful resources. Non-metallic materials in waste circuit boards generally account for more than 60%, and the main components are glass fiber and thermosetting epoxy resin. If these materials can be fully utilized, it can not only relieve the pressure of waste disposal, but also reduce the cost of materials, which has great economic significance and ...

Claims

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Application Information

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IPC IPC(8): C08J11/14C08J11/16C08L63/00C08L23/06C08L23/12C08L27/06C08L25/06
CPCY02W30/62Y02P20/52
Inventor 邱军李启胜王宗明
Owner TONGJI UNIV
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