Circuit board and manufacturing method thereof

A circuit substrate and manufacturing method technology, applied in circuit substrate materials, printed circuit manufacturing, printed circuits, etc., can solve the problems of scrapped electronic products, low reliability of copper clad laminates, and no bonding force revealed, and achieve good bonding force, The production process is simple and the effect of mass production is easy

Inactive Publication Date: 2012-07-04
GUANGDONG SHENGYI SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The patent application discloses a multi-layer sheet structure consisting of glass film, resin layer and copper foil layer, but the patent application does not disclose how to obtain good bonding force between the glass film surface and the resin layer
Because the surface of the glass film is smooth, the resin layer cannot form a good bond with the glass film, so that the circuit copper wires attached to the resin layer are easily peeled off from the glass film along with the resin layer, which will cause this The reliability of the copper clad laminate made in this way is not high in the process of production and use, and electronic products will be scrapped

Method used

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  • Circuit board and manufacturing method thereof
  • Circuit board and manufacturing method thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0073] Take an aluminosilicate glass membrane with a thickness of 30 μm, wash the surface of the glass membrane with ethanol, and then put 40.2 parts by mass of hydrofluoric acid, 26.8 parts by mass of ammonium fluoride, 3.9 parts by mass of sulfuric acid, and 29.1 parts by mass of Soak in a solution composed of deionized water for 50 minutes at room temperature, take it out and rinse it with water, dry it and then treat it with a coupling agent. A rough layer with a thickness of 6 μm is formed on the upper and lower sides of the test glass film.

[0074] Put a piece on the upper and lower sides of the glass film that has formed a rough layer, and use a glass fiber cloth (1080 glass fiber cloth) with a thickness of 0.06mm to impregnate an epoxy resin adhesive (dicyandiamide curing agent) to make a FR-4 prepreg ( That is, the prepreg used for the S1141 copper clad laminate product of Guangdong Shengyi Technology) is laminated; then a copper foil is placed on the upper and lower ...

Embodiment 2

[0077] Take a piece of aluminosilicate glass film with a thickness of 100 μm that has been annealed at 500 ° C, and then put it into a film made of 22.1 parts by mass of hydrofluoric acid, 23 parts by mass of ammonium fluoride, 37.2 parts by mass of hydrochloric acid, and 17.7 parts by mass of deionized water. Soak in the formed solution for 120 minutes at room temperature, take it out and rinse it with water, dry it and then treat it with a coupling agent. A rough layer with a thickness of 15 μm is formed on the upper and lower sides of the test glass film.

[0078] Put a piece on the upper and lower sides of the glass film that has formed a rough layer, and use a glass fiber cloth (1080 glass fiber cloth) with a thickness of 0.06mm to impregnate an epoxy resin glue to make a FR-4 prepreg (that is, S1141 of Guangdong Shengyi Technology) Prepregs for copper-clad laminate products), laminated; then put a piece of copper foil on the top and bottom, and then laminated.

[0079]Pu...

Embodiment 3

[0081] Put in a container a solution consisting of 45.1 parts by mass of water glass (sodium silicate), 37.2 parts by mass of hydrochloric acid, and 17.7 parts by mass of deionized water, heat the solution to about 40°C, and stir for about 30 minutes to form a reaction solution, and then the reaction solution was slowly stirred for 24 to 48 hours to obtain an immersion plating solution. Take a piece of borosilicate glass film with a thickness of 100 μm, wash it thoroughly and put it into the immersion plating solution for 30-40 seconds to obtain a gel layer. Then lift the glass film at a uniform speed of 5-25cm / min. Then dry at 110-150° C. for 20-30 minutes. Finally, heat treatment is carried out at 400-590° C. for 30 minutes, and then naturally cooled to room temperature. Rinse with water, dry and then treat with a coupling agent. A rough layer with a thickness of 18 μm is formed on the upper and lower sides of the test glass film.

[0082] Put a piece on the upper and low...

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Abstract

The invention relates to a circuit board which comprises a glass film with rough layers formed through surface roughening treatment, resin adhesive layers respectively positioned on the rough layers at two sides of the glass film and metal foils positioned at the outer sides of the resin adhesive layers, wherein the glass film, the resin adhesive layers and the metal foils are integrated through pressing. The circuit board provided by the invention adopts the glass film with the rough layers formed through surface roughening treatment as a carrier material, so that the resin adhesive layers and the surface of the glass film have good adhesion; the circuit board also has the characteristic that the difference of dielectric constants at directions X, Y, Z is small. The invention also relates to a manufacturing method of the circuit board.

Description

technical field [0001] The invention relates to a circuit substrate for printed circuit and a manufacturing method thereof. Background technique [0002] In recent years, with the development of electronic products in the direction of multi-function and miniaturization, the circuit boards used are developing in the direction of multi-layer, high-density wiring and high-speed signal transmission. , such as the comprehensive performance of copper clad laminates put forward higher requirements. [0003] For example, with the development of high-performance, high-functionality and networking of information and communication equipment, in order to transmit and process large-capacity information at high speed, the operating signal tends to be high-frequency, and the frequency of use of electronic products continues to increase, requiring circuit substrates to be dielectrically The loss is getting smaller and smaller, and the stability and uniformity of the dielectric constant of ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/03H05K3/00B32B15/04B32B17/06B32B7/12
Inventor 苏民社刘潜发
Owner GUANGDONG SHENGYI SCI TECH
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