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Polyamide hot melt adhesive and application thereof

A polyamide hot-melt adhesive and diamine technology, applied in adhesives, other chemical processes, chemical instruments and methods, etc., can solve the problem of low viscosity, achieve low water absorption, facilitate industrial production, oil resistance and chemical resistance high performance effect

Inactive Publication Date: 2012-07-11
SHANGHAI LIGHT IND RES INST +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Easy to mold due to low viscosity

Method used

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  • Polyamide hot melt adhesive and application thereof
  • Polyamide hot melt adhesive and application thereof
  • Polyamide hot melt adhesive and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0066] With 0.82mol dimer acid (purchased from British Woda Company, Pripol 1013, dimer acid content 95%), 0.15mol sebacic acid, 0.2mol 3,4'-diaminodiphenyl ether (purchased from Jinrui Co., Ltd. ), 0.03mol stearic acid and 1.2g antioxidant 1010 were put into a 1000ml three-necked flask, and the temperature was raised slowly under nitrogen protection until the sebacic acid in the bottle was completely dissolved, and the temperature was kept at 130-140°C. 0.80mol ethylenediamine was dropped into the reaction flask at this temperature. Generally, the dripping is finished within 30 minutes. During the dropping, the temperature in the reaction bottle should preferably be kept below 140°C. If it exceeds 140°C, the dropping speed can be stopped or slowed down until all the dropping is finished; add 10 drops of phosphoric acid. Slowly increase the reaction temperature at a heating rate of 20°C / hour until it rises to 230-240°C, keep this temperature for at least 1 hour, and measure th...

Embodiment 2～8

[0069] According to the formula in Table 1, with reference to the process of Example 1, polyamide hot-melt adhesive particles were prepared, and various properties of the obtained polyamide hot-melt adhesive were tested according to the above-mentioned test method.

[0070] The performance comparison is shown in Table 2.

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Abstract

The invention provides a polyamide hot melt adhesive and application thereof. The polyamide hot melt adhesive contains (1) dicarboxylic acid copolymerization units which comprise, on the basis of the total mole percent of the dicarboxylic acid copolymerization units, (a) 50 to 90 mol% of dimeric acid copolymerization units and (b) 10 to 50 mol% of C6-C14 aliphatic dicarboxylic acid copolymerization units, and (2) diamine copolymerization units which comprise, on the basis of the total mole percent of diamine copolymerization units, (c) 70 to 95 mol% of C2-C8 aliphatic or cycloaliphatic diamine copolymerization units and (d) 5 to 30 mol% of aromatic diamine copolymerization units; and number-average molecular weight Mn of the polyamide hot melt adhesive is 3000 to 20000. The polyamide hot melt adhesive provided in the invention has lower water absorption, better rub resistance, oil resistance and chemical resistance and higher hardness and can be used in, for example, the field of capsulation of electronic products.

Description

technical field [0001] The invention relates to a polyamide hot-melt adhesive and its application, in particular to a dimer acid type polyamide hot-melt adhesive and its application in the field of electronic packaging. Background technique [0002] With the rapid development of the electronics industry, higher requirements are placed on the packaging of electronic products. Traditional packaging materials use epoxy resin, polyurethane and silicone rubber adhesives. The application of epoxy resin and polyurethane is greatly affected by the external environment, especially the influence of external humidity. Epoxy resin is easily brittle in a low temperature environment (below 0°C), and polyurethane has insufficient high temperature resistance. , when the temperature exceeds 100°C, the structure becomes extremely unstable. Although electronic silicone can reach a wide temperature range and has excellent physical and electrical properties, the problem it faces is that the bo...

Claims

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Application Information

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IPC IPC(8): C09J177/08C09K3/10
Inventor 孙静施才财
Owner SHANGHAI LIGHT IND RES INST
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