Polyamide hot melt adhesive and application thereof
A polyamide hot-melt adhesive and diamine technology, applied in adhesives, other chemical processes, chemical instruments and methods, etc., can solve the problem of low viscosity, achieve low water absorption, facilitate industrial production, oil resistance and chemical resistance high performance effect
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[0065] Example 1
[0066] 0.82mol dimer acid (purchased from British Croda Company, Pripol 1013, dimer acid content 95%), 0.15mol sebacic acid, 0.2mol 3,4'-diaminodiphenyl ether (purchased from Jinrui Co., Ltd. ), 0.03mol stearic acid and 1.2g antioxidant 1010, drop into the 1000ml there-necked flask, slowly heat up under nitrogen protection, until the sebacic acid in the bottle is completely dissolved, keeping the temperature at 130~140 ℃. 0.80mol of ethylenediamine was dropped into the reaction flask at this temperature. Generally, the dripping is completed within 30 minutes, and the temperature in the reaction flask should preferably be kept below 140 °C during the dripping. Slowly increase the reaction temperature at a heating rate of 20°C / hour until it rises to 230-240°C, keep this temperature section for at least 1 hour, and measure the distilled water, when it reaches 80% of the theoretical amount, gradually reduce the pressure; Finally, the whole reaction is complete...
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[0068] Examples 2 to 8
[0069] According to the formula in Table 1, with reference to the process of Example 1, polyamide hot-melt adhesive particles were prepared, and various properties of the obtained polyamide hot-melt adhesive were tested according to the above-mentioned test method.
[0070] The performance comparison is shown in Table 2.
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