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Base-generating agent, photosensitive resin composition, material for pattern-forming comprising said photosensitive resin composition, pattern-forming method using said photosensitive resin composition, and article

A technology of photosensitive resin and alkali generator, applied to alkali generator, photosensitive resin composition, material for pattern formation formed from the photosensitive resin composition, pattern formation and articles using the photosensitive resin composition It can solve the problems such as the inability to obtain polyimide physical properties and the structural limitations of polyimide precursors, and achieve the effects of large solubility contrast, excellent sensitivity, and excellent sensitivity

Inactive Publication Date: 2012-07-11
DAI NIPPON PRINTING CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0010] Compared with the method (1), the method (2) does not require a resist layer, so the process can be greatly simplified, but the method (i) has the following problem: if the naphthoquinone diazide derivative is added to improve the solubility contrast If the amount added, the original physical properties of polyimide cannot be obtained.
In addition, there is a problem that the structure of the polyimide precursor is restricted in the method of (ii)

Method used

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  • Base-generating agent, photosensitive resin composition, material for pattern-forming comprising said photosensitive resin composition, pattern-forming method using said photosensitive resin composition, and article
  • Base-generating agent, photosensitive resin composition, material for pattern-forming comprising said photosensitive resin composition, pattern-forming method using said photosensitive resin composition, and article
  • Base-generating agent, photosensitive resin composition, material for pattern-forming comprising said photosensitive resin composition, pattern-forming method using said photosensitive resin composition, and article

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Embodiment

[0369] Hereinafter, the present invention will be specifically described with reference to examples. The present invention is not limited by these descriptions. In addition, in an Example, "part" means a "weight part" unless otherwise indicated. pass 1 H NMR measurement to confirm the chemical structure of the produced base generator.

[0370] In addition, each measurement and experiment were performed using the apparatus shown below.

[0371] 1 H NMR measurement: JEOL JNM-LA400WB manufactured by JEOL Ltd.

[0372] Manual exposure: manufactured by Dainippon Research Institute, MA-1100

[0373] Absorbance measurement: Shimadzu Corporation, ultraviolet-visible spectrophotometer UV-2550

[0374] Measurement of temperature at 5% weight loss: Shimadzu Corporation, differential thermal-thermogravimetric simultaneous measuring device DTG-60

[0375] Infrared absorption spectrometry: FTS7000, manufactured by Varian Technologies Japan limited

[0376] Heating of the coating fil...

Synthetic example 1

[0377] (Synthesis example 1: Synthesis of polyimide precursor)

[0378] 10.0 g (50 mmol) of bis(4-aminophenyl) ether was dropped into a 300 mL three-necked flask, dissolved in 105.4 mL of dehydrated N,N-dimethylacetamide (DMAc) and heated under a nitrogen stream. Stir while cooling in an ice bath. Add 14.7 g (50 mmol) of 3,3',4,4'-biphenyltetracarboxylic acid 3,4:3',4'-dianhydride little by little, and stir in an ice bath for 5 hours after the addition , Utilize the dehydrated diethyl ether to carry out reprecipitation to the solution, dry the precipitate at room temperature and under reduced pressure for 17 hours, and quantitatively obtain polyamic acid (polyamic acid) with a weight average molecular weight of 10,000 in the form of white solid Amine Precursor (1)).

Synthetic example 2

[0379] (Synthesis example 2: Synthesis of metal alkoxide condensate)

[0380] 5 g of phenyltriethoxysilane, 10 g of triethoxysilane, 0.05 g of ammonia water, 5 ml of water, and 50 ml of propylene glycol monomethyl ether acetate were added to a 100 ml flask with a condenser. The solution was stirred with a semicircular mechanical stirrer, and reacted at 70° C. for 6 hours using a mantle heater. Next, ethanol and residual water produced in the condensation reaction with water were removed using an evaporator. After completion|finish of reaction, the flask was left to room temperature, and the condensate (alkoxysilane condensate (1)) of an alkoxysilane was prepared.

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Abstract

Disclosed is a photosensitive resin composition that has excellent resolution, low cost, and wherein there is a wide range of structurally applicable options for a polymer precursor wherein the reaction towards an end product is promoted by means of a basic substance or by means of heating under the presence of a basic substance. Further disclosed is a base-generating agent that can be used in this type of photosensitive resin composition. The base-generating agent is characterized by having a specific structure and by generating a base by means of heating and being irradiated by electromagnetic waves, and the photosensitive resin composition is characterized by containing the polymer precursor that promotes the reaction towards an end product by means of said base-generating agent and a basic substance or by means of heating under the presence of a basic substance.

Description

technical field [0001] The present invention relates to a base generator that generates a base by irradiation and heating of electromagnetic waves, and a photosensitive resin composition using the base generator, and particularly relates to a photosensitive resin composition that can be suitably used in a patterning process using electromagnetic waves or a curing acceleration process. A photosensitive resin composition as a material for a product or part to be formed, a pattern forming material formed from the photosensitive resin composition, a pattern forming method, and an article produced using the resin composition. Background technique [0002] The photosensitive resin composition is used for, for example, electronic parts, optical products, molding materials for optical parts, layer forming materials, adhesives, etc., and is particularly suitable for use in products or members formed through a patterning process using electromagnetic waves. [0003] For example, polyi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09K3/00C07D295/18G03F7/004G03F7/038H01L21/027
CPCG03F7/0045G03F7/0387C07D295/18C07D401/10G03F7/038Y10T428/24802G03F7/0382G03F7/20G03F7/2002
Inventor 片山麻美福田俊治坂寄胜哉
Owner DAI NIPPON PRINTING CO LTD
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