Preparation method of nickel nanometer particle/silicon nanometer wire magnetic composite material
A technology of magnetic composite materials and silicon nanowires, applied in the direction of magnetic materials, nanomagnetism, magnetic objects, etc., can solve the problems of high cost, harsh preparation conditions, high repeatability, etc., and achieve low cost, simple preparation method, high reproducible effect
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[0035] a) Wafer cleaning
[0036] Take a 1cm×1cm silicon wafer (p-type, double-sided polishing, crystal orientation, resistivity 0.1-10Ω·cm), clean the silicon wafer with standard RCA cleaning steps and dry it with nitrogen gas for later use.
[0037] b) Preparation of silicon wafer chemical etching solution
[0038] Configure 25 mmol L -1 AgNO 3 , hydrofluoric acid (40% HF concentration) mixed solution (25 mmol L -1 AgNO 3 and concentration of 40% HF (volume ratio 1:1) 200 mL, sonicate to make the mixed solution evenly distributed.
[0039] c) Chemical etching of silicon wafers to prepare silicon nanowires
[0040] The silicon chip undergoes a chemical replacement reaction in the chemical etching solution, and the surface of the silicon chip is etched to form a silicon nanowire structure. vertically) into the solution (the silicon wafer is completely submerged in the solution), ensuring that the etching rate on both sides of the silicon wafer is the same, the reaction ...
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