Paper base printing circuit board with protective layer and preparation method thereof

A printed circuit board and printed circuit technology, which is applied to printed circuit parts, printed circuit secondary treatment, non-metallic protective layer coating, etc., can solve problems such as key failure, improve reliability, simple production process, avoid The effect of micro-short circuit phenomenon

Inactive Publication Date: 2012-07-18
SHENZHEN SKYWORTH DIGITAL TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In order to solve the above problems, the present invention aims to provide a paper-based printed circuit board w

Method used

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  • Paper base printing circuit board with protective layer and preparation method thereof
  • Paper base printing circuit board with protective layer and preparation method thereof
  • Paper base printing circuit board with protective layer and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0043] Example one

[0044] A paper-based printed circuit board with a protective layer includes a paper-based printed circuit board with electronic components and a protective layer. The protective layer is a conformal coating. The components and content of the conformal coating are: siloxane grafted polyurethane-polyacrylate (PUA) 56%, siloxane modified acrylate 34%, photoinitiator 1173 (2-hydroxy-2-methylbenzene) Base acetone-1) 6.0%, coupling agent dibutyl tin dilaurate 0.5%, leveling agent polysiloxane-polyether copolymer 0.5%, defoaming agent dimethyl polysiloxane 2.25%, wetting agent Cross-linked silicone polyether acrylate 0.25%.

[0045] Such as figure 1 As shown, the paper-based printed circuit board with a protective layer is manufactured through the following steps: (1) The electronic components are fixed on the empty paper-based printed circuit board by wave soldering to obtain a paper-based printed circuit board with electronic components (2) Coating the conformal ...

Example Embodiment

[0049] Example two

[0050] Compared with Example 1, the difference of this example is that the component content of the conformal coating is different: siloxane grafted polyurethane-polyacrylate (PUA) 61%, siloxane modified acrylate 35%, Photoinitiator 1173 (2-hydroxy-2-methylphenylacetone-1) 3.0%, coupling agent dibutyltin dilaurate 0.5%, leveling agent polysiloxane-polyether copolymer 0.1%, defoamer Dimethyl polysiloxane 0.2%, wetting agent cross-linked silicone polyether acrylate 0.2%.

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PUM

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Abstract

The invention provides a paper base printing circuit board with a protective layer and a preparation method thereof. The paper base printing circuit board with the protective layer comprises a paper base printing circuit board with electronic components and a protective layer. The protective layer is a conformal paint which mainly comprises organic silicone acrylate oligomer and low-viscosity monoacrylate oligomer. The paper base printing circuit board with the protective layer is prepared by wave soldering, painting coating and paint photocuring. The paper base printing circuit board with the protective layer provided by the invention can effectively solve the problem of micro short circuit caused by flux residue; the preparation method is simple, and quality of products is reliable.

Description

technical field [0001] The invention relates to a printed circuit board, in particular to a paper-based printed circuit board with a protective layer and a preparation method thereof. Background technique [0002] Due to its low price, paper-based printed circuit boards are widely used as accessory boards such as keying boards and power boards of electronic equipment. However, currently on the market, electronic devices such as keying boards and power boards prepared by paper-based printed circuit boards, if the keying boards and power boards are soldered with organic acid flux during the manufacturing process, these electronic devices will There will be a large number of failures such as button failure when used in different regions. Through the analysis of the faulty electronic equipment, it was found that metal ion migration occurred between the solder joints on the attached board, and a micro-short circuit occurred between the solder joints and between the high and low ...

Claims

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Application Information

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IPC IPC(8): H05K1/02H05K3/28C09D4/02C09D7/12
Inventor 徐康
Owner SHENZHEN SKYWORTH DIGITAL TECH CO LTD
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