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Method for preparing ultrafine copper powder at room temperature

An ultra-fine copper powder, room temperature technology, applied in the field of materials, can solve the problems of restricting the industrial production and practical application of ultra-fine copper powder, and achieve the effect of short reaction time, favorable for recycling and no agglomeration

Inactive Publication Date: 2012-07-25
UNIV OF ELECTRONIC SCI & TECH OF CHINA
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  • Application Information

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Problems solved by technology

This has largely restricted the industrial production and practical application of liquid phase reduction method to prepare ultrafine copper powder.

Method used

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  • Method for preparing ultrafine copper powder at room temperature
  • Method for preparing ultrafine copper powder at room temperature
  • Method for preparing ultrafine copper powder at room temperature

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Embodiment Construction

[0023] A method for preparing superfine copper powder at room temperature, comprising the following steps:

[0024] Step 1: Prepare copper salt solution; use copper acetate as solute and ethylene glycol as solvent, prepare copper acetate ethylene glycol solution as copper salt solution, wherein the mass concentration of copper acetate is controlled between 2.9g / L~20g / L between;

[0025] Step 2: preparing a reducing protection solution; using ascorbic acid as a reducing agent and polyvinylpyrrolidone as a protecting agent, dissolving the reducing agent and the protecting agent in ethylene glycol to obtain a reducing protection solution; the mass of the reducing agent The concentration is controlled between 11g / L~50g / L, and the mass concentration of the protective agent is controlled between 2.5g / L~100g / L;

[0026] Step 3: liquid phase reduction reaction; under room temperature, the copper salt solution prepared in step 1 and the reducing protection solution prepared in step 2 ...

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Abstract

A method for preparing ultrafine copper powder at room temperature belongs to the technical field of materials. Copper acetate and ascorbic acid are used as main reactants, ethylene glycol is used as a reaction medium, polyvinylpyrrolidone is used as a protective agent, glycol nantokite solution of the copper acetate and reducing protection solution dissolved with the ascorbic acid and the polyvinylpyrrolidone are mixed at the room temperature according to the molar ratio of the copper acetate to the ascorbic acid to perform liquid phase reaction, and solids are collected, washed and dried during reaction to obtain the ultrafine copper powder, wherein the molar ratio of the copper acetate to the ascorbic acid is 1:(2-10). The method for preparing the ultrafine copper powder at the room temperature can be directly implemented at normal temperature and under normal pressure, an external heating source is omitted, the method is convenient to implement and low in cost, the green and environment-friendly ascorbic acid without toxic or side effects on a human body is used as a reducing agent and is beneficial to recycling, the prepared ultrafine copper powder is uniform in size distribution, free of agglomeration and fine in dispersibility, and the method is simple in technological process, short in reaction time and convenient in industrial production.

Description

technical field [0001] The invention belongs to the technical field of materials and relates to functional materials, especially a method for preparing ultrafine copper powder at room temperature. Background technique [0002] The surface effect, small size effect, quantum effect and macroscopic tunnel effect of ultrafine metal particles make them have extremely important application value in the fields of integrated circuits, catalysis, lubrication, antibacterial, electromagnetic shielding and so on. At present, ultrafine particles of some noble metals such as gold, platinum, and silver have been extensively studied, while metal copper particles are easily oxidized, have poor particle dispersibility, and are not easy to control the shape, so there are few related studies. Compared with noble metal particles, metal copper is relatively cheap and has good electrical conductivity, which makes it have a wide range of application prospects. [0003] At present, the methods for ...

Claims

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Application Information

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IPC IPC(8): B22F9/24
Inventor 何为周珺成周国云唐耀王守绪
Owner UNIV OF ELECTRONIC SCI & TECH OF CHINA
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