Electronic protecting glue, and preparation method and application thereof

A technology of electronic protection and protective glue, which is applied in the direction of adhesives, adhesive types, coatings, etc., can solve the problems of poor UV resistance and moisture resistance, poor bonding performance, and use restrictions, and achieve UV resistance and moisture resistance. Excellent, low equipment requirements, and stable performance

Active Publication Date: 2012-07-25
深圳市兴时达科技产品有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Among them, epoxy resin electronic protective adhesive has good bonding performance and low price, but it is easy to crack, and has poor resistance to ultraviolet light and heat and humidity; organic silicon electronic protective adhesive has excellent resistance to ultraviolet light and heat and humidity, but poor bonding performance and expensive price. The type of polyurethane or phenolic electronic protective glue contains a large amount of organic solvents, and its use is strictly restricted in today's increasingly stringent environmental protection requirements.

Method used

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  • Electronic protecting glue, and preparation method and application thereof
  • Electronic protecting glue, and preparation method and application thereof
  • Electronic protecting glue, and preparation method and application thereof

Examples

Experimental program
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Effect test

preparation example Construction

[0029] The embodiment of the present invention also provides the preparation method of above-mentioned electronic protective adhesive, and its technological process is as follows figure 1 shown. The method comprises the steps of:

[0030] S01. Weigh the formula components: weigh each component according to the formula of the above-mentioned electronic protective glue;

[0031] S02. Preparation of electronic protective glue: adding alkyd resin, amino resin, and silicone resin to the protective colloid solvent to dissolve and disperse evenly, and then packaging to obtain the electronic protective glue.

[0032] Specifically, in the above step S01, the formula of the electronic protection glue and the preferred content and types of each component in the formula are as described above, and will not be repeated here to save space.

[0033] In the above step S02, the method of dissolving alkyd resin, amino resin, silicone resin and other components adopts a high-speed dispersion s...

Embodiment 1

[0038] The formula component of the weight percentage of electronic protective glue is as follows:

[0039]

[0040] The preparation method of this electronic protective glue is as follows:

[0041] S11: Weigh each component according to the formula of the above-mentioned electronic protective glue;

[0042] S12: Add the alkyd resin, amino resin, and silicone resin among the above components into a protective colloid solvent to dissolve and disperse evenly, then filter and pack to obtain the electronic protective colloid.

[0043] After the electronic protective glue prepared in this example is used for the circuit board to be immersed in the protective glue and cured to form a film, the measured insulation resistance value is 5.8×10 11 Ω. After 168 hours in a constant temperature and humidity box at 85°C and 85% RH, the measured insulation resistance value is 5.2×10 11 Ω, the insulation resistance value basically does not change, and other performances are detected to b...

Embodiment 2

[0045] The formula component of the weight percentage of electronic protective glue is as follows:

[0046]

[0047] The preparation method of the electronic protective glue is the same as the preparation method in Example 1.

[0048] After the electronic protective glue prepared in this example is used for LED circuit boards to be immersed in the protective glue and cured to form a film, the measured insulation resistance value is 7.3×10 10 Ω. After 168 hours in a constant temperature and humidity box at 85°C and 85% RH, the measured insulation resistance value is 6.5×10 10 Ω, the insulation resistance value basically does not change, and other performances are detected to be normal, meeting the requirements for protecting circuit boards.

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Abstract

The invention discloses electronic protecting glue, and a preparation method and application thereof. The electronic protecting glue comprises, in weight percentage, 5-30% of alkyd resin, 2-8% of amino resin, 5-50% of organic silicon resin, and 30-60% of protecting glue solvent. The preparation method of the electronic protecting glue includes the steps: respectively weighing the components according to electronic protecting glue formulas described in claim one to six; adding and evenly dispersing the alkyd resin, the amino resin and the organic silicon resin into the protecting glue solvent,and packaging to obtain the electronic protecting glue. The electronic protecting glue is excellent in ultraviolet resistance and damp-heat resistance, fine in adhesive property, less prone to cracking, stable in performances, safe and environment-friendly. The defects of existing electronic protecting glue, such as proneness to cracking, poor adhesive property and low price, are overcome effectively. The preparation method of the electronic protecting glue is simple in process, low in cost, and applicable to industrial production and has low equipment requirements.

Description

technical field [0001] The invention belongs to the technical fields of chemical industry and electronics, and in particular relates to a kind of electronic protective glue and its preparation method and application Background technique [0002] Electronic protective glue is used for bonding, sealing, potting and coating protection of electronic components. [0003] In order to ensure that circuit boards, electronic devices, LED chips, etc. maintain good insulation performance during use, avoid external impact and damage, and will not be affected by machinery, heat, humidity, dust, oily smoke, corrosive gases, etc., and improve performance and stabilization parameters, these devices need to be coated with protective coating or packaged. Because it is liquid before use, it is easy to pour and use. It is often used for bonding, sealing, potting and coating protection of electronic components and optoelectronic devices. It can prevent moisture, dust, corrosion, Shockproof eff...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J183/04C09J167/08C09J161/20C09J161/32C09D183/04C09D167/08C09D161/20C09D161/32
Inventor 吴亚军吴超
Owner 深圳市兴时达科技产品有限公司
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