Reflow soldering system by aid of liquid nitrogen cooling and soldering method thereof

A technology of reflow soldering and liquid nitrogen, which is applied in welding equipment, manufacturing tools, metal processing, etc., can solve problems such as heating, overheating, and printed circuit boards cannot be heated evenly, and achieve increased soldering area and good temperature uniformity , Increase the effect of liquid nitrogen cooling function

Active Publication Date: 2012-08-01
HUAZHONG UNIV OF SCI & TECH
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

If the temperature of the heating zone fluctuates up and down during heating, the printed circuit board cannot be heated uniformly, partially causing overheating and insufficient heating, thereby causing thermal damage to electronic components and non-melting of solder paste

Method used

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  • Reflow soldering system by aid of liquid nitrogen cooling and soldering method thereof
  • Reflow soldering system by aid of liquid nitrogen cooling and soldering method thereof
  • Reflow soldering system by aid of liquid nitrogen cooling and soldering method thereof

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Embodiment Construction

[0044] In order to make the objectives, technical solutions and advantages of the present invention clearer, the following further describes the present invention in detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention, but not to limit the present invention.

[0045] figure 1 It is a plan view of the main functional components of the reflow soldering system according to the present invention. Such as figure 1 As shown in the figure, the reflow soldering system according to the present invention mainly includes a test box 7 filled with nitrogen in a sealed state, and a work turntable 3 arranged inside the test box 7 for placing electronic components and solder to be soldered, for the welding process An electric heating device for heating the solder used in the, and a liquid nitrogen cooling device for cooling the molten and reflowed solder, and the ...

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Abstract

The invention discloses a reflow soldering system and a corresponding soldering method thereof. The reflow soldering system comprises a sealed test box with the interior filled with nitrogen, a working turntable arranged in the test box, an electric heating device and a liquid nitrogen cooling device, wherein the working turntable is formed by a rotating shaft and a turntable and used for placing electronic components to be soldered and soldering fluxes, the electric heating device comprises a power supply, an electric heating element and a corresponding fan, and the liquid nitrogen cooling device comprises a self-pressurization liquid nitrogen container, a liquid nitrogen distributor, a low-temperature valve and a corresponding fan. The reflow soldering system by aid of liquid nitrogen cooling and the soldering method thereof can use nitrogen as protection gas to perform electric heating, simultaneously use liquid nitrogen to achieve cooling, and therefore technical effects including uniform soldering flux heating, soldering flux cooling and one-time massive soldering in mionectic environment are achieved.

Description

Technical field [0001] The present invention relates to the field of soldering, and more specifically, to a reflow soldering system and a corresponding soldering method. Background technique [0002] At present, large and medium-sized reflow furnaces for soldering printed circuit boards generally consist of a heating zone, a heat preservation zone, a soldering zone and a cooling zone, while small reflow soldering furnaces use a cavity to achieve heating and cooling. During the soldering process, the solder paste melts to solidify, thereby forming a finished electronic circuit. [0003] As the heating mechanism of the reflow oven, the prior art usually uses infrared heaters and hot blast heaters. Most infrared heaters use quartz tubes for infrared heating. The temperature control of this heating method is difficult. The hot air heating method has the characteristics of high heat transfer efficiency and excellent heating capacity. [0004] As a cooling method of the reflow oven, fa...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K3/00B23K3/047B23K3/08B23K1/00
Inventor 刘胜桂许龙罗小兵周洋陈明祥
Owner HUAZHONG UNIV OF SCI & TECH
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