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Device and method for measuring dynamic elasticity modulus in temperature environment

A technology for elastic modulus and dynamic measurement, which is applied in the direction of measuring devices, strength characteristics, instruments, etc., can solve the problem that there is no effective measurement system for measuring dynamic elastic modulus, it is difficult to control temperature for elastic modulus, and there are limitations in the measurement of brittle materials In order to achieve the effect of stable excitation effect, simple structure and wide application range

Inactive Publication Date: 2013-10-16
BEIHANG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] (2) It is difficult to control the temperature when measuring the elastic modulus by the static method, and there are certain difficulties in measuring the elastic modulus under the temperature environment;
[0005] (3) There are limitations in the measurement of the macroscopically equivalent elastic modulus of heterogeneous materials, and there are limitations in the measurement of brittle materials;
At present, there is no effective, simple and easy-to-operate measurement system for measuring dynamic elastic modulus under temperature environment in China

Method used

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  • Device and method for measuring dynamic elasticity modulus in temperature environment
  • Device and method for measuring dynamic elasticity modulus in temperature environment
  • Device and method for measuring dynamic elasticity modulus in temperature environment

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Embodiment Construction

[0033] The present invention will be further described in detail below in conjunction with the accompanying drawings.

[0034] The present invention is a kind of measuring device of dynamic modulus of elasticity under the temperature environment, such as figure 1 As shown, it includes electric heating plate 1, test piece 2, thermocouple 3, piezoelectric ceramic sheet 4, rigid fixed table 5, bolt 6, fixed splint 7, laser vibration measurement camera 8, bracket 9, temperature controller 10, power Amplifier 11, signal generator 12, laser vibrometer 13, computer 14.

[0035] Such as figure 2 As shown, the test piece 2 has a through hole A101, and the bolt 6 clamps the test piece 2 on the rigid fixed platform 5 through the through hole A101, and the root of the test piece 2 is pasted with a piezoelectric ceramic sheet 4.

[0036] Such as image 3 As shown, the rigid fixing platform 5 has a through hole B102, and the bolt 6 fixes the test piece 2 on the rigid fixing platform 5 t...

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Abstract

The invention discloses a device and a method for measuring dynamic elasticity modulus in the temperature environment. The technical scheme of the device includes that a beam-shaped test piece is clamped on a fixed rigidity table in a manner of a cantilever state with one end fixed and the other end free; by the aid of a resistance heating device, a thermocouple feeds back temperature and a temperature controller controls heating and temperature of the test piece, a piezoelectric ceramic vibration exciter mounted on the test piece receives excitation signals amplified by a signal amplifier to excite the test piece, a laser vibration measurer performs modal tests on the test piece in the temperature environment, a computer receives signals of the laser vibration measurer, acquires fixed frequency and modal of each step in the controlled temperature environment through signal analysis and calculates dynamic elasticity modulus of materials in the controlled temperature environment by tested fixed frequency according to the relation between the fixed frequency and the elasticity modulus. The device has the advantages of nondestructive testing, convenience in use and operation, high measuring accuracy and the like.

Description

technical field [0001] The invention relates to the field of elastic modulus measurement, in particular to a measuring device and a measuring method for measuring dynamic elastic modulus in a temperature environment, which are used for measuring dynamic elastic modulus in a temperature environment. Background technique [0002] The elastic modulus E is an important index in the mechanical properties of materials, and it is a scale that characterizes the ability of solid materials to resist deformation. From a microscopic point of view, it is the reaction of the bond strength between atoms, ions or molecules. The modulus of elasticity cannot be measured directly, but needs to be calculated indirectly after measurement. With the development of science and technology, the working environment of materials is also more complicated. In engineering design, only considering the elastic modulus of materials in normal temperature environment can no longer meet the engineering require...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01N3/00
Inventor 赵寿根朱正义邱志平吴爽王杰王晓军吴大方
Owner BEIHANG UNIV
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