Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Eutectic process for coating tin on substrate and chip mounting method thereof

A technology of chip loading and tin coating, applied in electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve problems such as chip rotation or twisting, chip size requirements, scrapping, etc., to improve chip loading quality and reliable packaging The effect of sexual enhancement and avoidance of delamination

Inactive Publication Date: 2012-08-01
CHANGJIANG ELECTRONICS TECH CHUZHOU
View PDF3 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Lead-tin soldering chip mounting can combine the advantages of eutectic chip mounting and conductive adhesive chip mounting. The main defect of this chip mounting method is the requirement for chip size. If the chip size is too small, it will The chip will rotate or twist, resulting in defective and scrapped

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0025] A kind of basal island coating tin eutectic technology and its loading method of the present invention, it comprises the following process steps:

[0026] Step 1. Using the existing mature technology, the metal part of the lead frame is made by stamping or etching;

[0027] Step 2. Electroplate the lead frame produced in step 1 on the ball bonding area to meet the requirements of ball bonding. The electroplating material can be silver, nickel palladium gold, nickel gold or copper, etc. The electroplating method can be wet film electroplating, pressure plate electroplating, Electroless plating or other means of electroplating;

[0028] Step 3: Coating tin or tin alloy at the position of the lead frame where the electroplating of the ball soldering area is completed in step 2. The coating method can be wet film electroplating, pressure plate electroplating, chemical plating, or use a mask to brush solder paste, etc. Way;

[0029] If the lead frame is coated with tin or ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to a eutectic process for coating tin on a substrate and a chip mounting method thereof. The chip mounting method includes the following process steps: step one, utilizing an existing process to manufacture a metal portion of a lead frame; step two, performing ball bonding area plating on the lead frame manufactured in the step one; step three, coating tin or tin alloy at the chip mounting position of the lead frame which finishes ball bonding area plating in the step two; and step four, performing eutectic chip mounting on the lead frame which finishes coating operation, and enabling the chip mounting position of the frame to be combined together with a back gold chip and a back silver chip. The eutectic process for coating tin on the substrate and the chip mounting method of the eutectic process have no requirements for the chip size. After a layer of tin or tin alloy is coated on the substrate, due to the fact that the thickness of the tin or the tin alloy can be controlled, the thickness of the tin or the tin alloy layer can effectively absorb different stress between the chip and the substrate, and problems of delamination and cracking of a traditional eutectic chip are solved.

Description

technical field [0001] The invention relates to a base island coating tin eutectic process and a chip loading method thereof, belonging to the technical field of semiconductor packaging. Background technique [0002] In the field of medium and high-power semiconductor packaging, there are mainly three traditional chip mounting technologies: one is eutectic chip mounting, the other is conductive adhesive chip mounting, and the third is lead-tin soldering chip mounting, and lead-tin soldering chip mounting It can be subdivided into lead-tin wire mounting and lead-tin glue mounting, but at present, these several mounting methods have their own defects: [0003] 1. Eutectic loading [0004] For eutectic chip mounting, a layer of gold or gold-arsenic alloy or silver alloy needs to be plated on the back of the chip, and then a layer of silver is generally plated on the base island chip mounting position, and then eutectic chip mounting can be performed. During eutectic chip load...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H01L21/60
Inventor 谢洁人王新潮俞斌吴昊
Owner CHANGJIANG ELECTRONICS TECH CHUZHOU
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com