Compound double-side copper clad laminate and manufacturing method thereof

Abstract

The invention discloses a compound double-side copper clad laminate and the manufacturing method thereof. The compound double-side copper clad laminate is manufactured in the way that a non-adhesive single-side copper-clad laminate composed of a copper foil and an insulating basal membrane formed on one surface of the copper foil is hot-pressed with an adhesive copper foil laminate composed of another copper foil and an insulating assembly glue layer applied on one surface of the copper foil under the condition of low temperature. The problems of adopting a high-temperature pressing processing procedure in the prior art and using expensive raw material of TPI can be avoided, and the compound double-side copper clad laminate meeting the requirements of characteristics of a non-adhesive double-side laminate can be obtained, so that not only is the manufacturing cost saved, but also the production yield of products can be improved, the application range of the products is expanded; and the compound double-side laminate provided by the invention has excellent dimensional stability and bending resistance and has the advantages of masking effect, high heat resistance and high reflectivity.

Description

technical field [0001] The invention belongs to the field of flexible printed circuit board structure and technology, and specifically relates to a composite double-sided copper foil substrate and a manufacturing method thereof. Background technique [0002] At present, the development trend of the global electronics industry is developing in the direction of light and thin, high heat resistance, multi-functionality, high density, high reliability, and low cost. Therefore, the selection of substrates has become a very important factor. A good substrate must have the material properties of high thermal conductivity, high dimensional stability, high color shielding effect, high heat dissipation, high heat resistance, and low thermal expansion coefficient. Polyimide resin has high thermal stability and excellent heat dissipation, mechanical strength and adhesiveness, and is often used in various electronic materials, such as flexible printed circuit boards (Flexible Printed Cir...

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Problems solved by technology

Although the original intention of the patent 200810217932.6 is to provide a method that can overcome the shortcomings of the difficulty of thinning and poor dimensional stability in the manufacture of double-sided flexible copper-clad laminates by the three-layer method, as well as the high cost and poor appearance of the two-layer flexible cover film , and excellent overall performance, low cost, double-sided flexible copper-clad laminate and its manufacturing method that can realize the thinning of the base material, but it will have the following defects in actual production: the production process is relatively difficult, and the equipment needs to control the tension It is very good. After the adhesive layer is applied, it is easy to produce wrinkles in the pressing section, the length cannot be made long, and the yield rate is not high. The yield rate is only about 30%.

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