Preparation method of high-quality 6061 aluminium alloy forging for semiconductor equipment

A semiconductor and aluminum alloy technology, which is applied in the field of non-ferrous metal forging processing, can solve the problems of the uniformity of alloy structure and grain size being not strict, it is difficult to meet the use requirements of semiconductor equipment, and it is difficult to meet the use requirements. Good tissue uniformity, significant economic and social benefits, and high product added value

Active Publication Date: 2012-08-22
GRIMAT ENG INST CO LTD
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  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

With the rapid development of my country's semiconductor equipment industry, the demand for high-quality 6061 aluminum alloys is growing rapidly, but domestic 6061 aluminum alloy forgings are difficult to meet the use requirements. The quality of the rear film layer is poor, and it is easy to cause large-area corrosion and scrap in the harsh working environment of semiconductor equipment
Since domestic aluminum alloy forgings are mainly used for load-bearing structural parts, the conventional forging process only achiev

Method used

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  • Preparation method of high-quality 6061 aluminium alloy forging for semiconductor equipment
  • Preparation method of high-quality 6061 aluminium alloy forging for semiconductor equipment
  • Preparation method of high-quality 6061 aluminium alloy forging for semiconductor equipment

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0022] According to the 6061 aluminum alloy, the common semi-continuous casting casting process is adopted to obtain the billet with a size of Φ300×760mm, and the billet is homogenized and heat-treated in an air resistance furnace with a cyclone. The heat treatment system is 560°C×24h+580°C×24h , air cooling after heat treatment. The heat-treated billet is machined to a size of Φ275×740mm, and the machined billet is placed in an air resistance furnace for heating and heat preservation before forging at 480°C×225min. The billet is forged in two fires, and the forging is carried out on a 1600t hydraulic press. The first fire adopts the forging process of two upsetting and two drawing, and the specific deformation process is as follows (unit, mm):

[0023]

[0024]

[0025] After the first fire forging, the forging is returned to the furnace for heat preservation. The heat preservation system is 480℃×50min. After heat preservation, the second fire forging is carried out. Th...

Embodiment 2

[0031] According to the 6061 aluminum alloy, the ordinary semi-continuous casting casting process is adopted to obtain a billet with a size of Φ260×750mm, and the billet is subjected to homogenization heat treatment in an air resistance furnace with a cyclone, and the heat treatment system is 560°C×24h+580°C×24h , air cooling after heat treatment. The heat-treated billet is machined to a size of Φ245×730mm. The machined billet is placed in an air resistance furnace for heating and heat preservation before forging at 480°C×184min. The billet is forged in two fires, and the forging is carried out on a 1600t hydraulic press. The first fire adopts the forging process of two upsetting and two drawing, and the specific deformation process is as follows (unit, mm):

[0032]

[0033]

[0034]

[0035] Due to the relatively large height and diameter of the billet, double drums appear during the upsetting process, and corresponding straightening treatment is carried out in the ...

Embodiment 3

[0042] According to the 6061 aluminum alloy, the ordinary semi-continuous casting casting process is adopted to obtain a billet with a size of Φ200×540mm, and the billet is homogenized and heat-treated in an air resistance furnace with a cyclone. The heat treatment system is 560°C×24h+580°C×24h , air cooling after heat treatment. The heat-treated blank is machined to a size of Φ180×520mm, and the machined blank is placed in an air resistance furnace for heating and heat preservation before forging at 480°C×150min. Forging is carried out on an 800t hydraulic press.

[0043] The specific deformation process is as follows (unit, mm):

[0044]

[0045]

[0046]

[0047]After forging, the forging is subjected to solution aging treatment. The solution process is 530°C×140min, water quenching after solution, and then 4% pre-compression treatment on the press, followed by artificial aging treatment at 170°C×18h.

[0048] The high and low magnification inspection of the forg...

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Abstract

A preparation method of a high-quality 6061 aluminium alloy forging for semiconductor equipment comprises the following steps of: (1) blank making by a common semicontinuous casting method; (2) homogenization heat treatment of 6061 aluminium alloy by two-stage homogenization technology, wherein a first-stage temperature range is 540-570 DEG C, heat preservation time is selected to be 12-24 hours, a second-stage temperature range is 570-620 DEG C, and heat preservation time is selected to be 18-24 hours; (3) forging technology, wherein a preheating temperature of a press chopping block is 300-350 DEG C, the maximal forging heating time is not more than 3 when multi-heating forging is employed, an upsetting forging ratio for each heating is controlled to be 4-6 when forging with 2-3 heating times is employed, the forging ratio is controlled to be 7-9 when forging with one heating time is employed, and the final forging temperature is controlled to be 320-360 DEG C; (4) solid solution aging technology, wherein a solid solution temperature is 520-540 DEG C, heat preservation time is on a basis of 45 min, the heat preservation time increases by 1 min when the thickness of the forging increases by 1 mm, an aging temperature is 160-180 DEG C, and heat preservation time is between 16-25 hours. The invention provides the preparation method of a high-quality 6061 aluminium alloy forging for semiconductor equipment, and the method has the advantages of strong operability, high yield, stable product performance, high product added value, and the like, is applicable to production for small-lot supply, and has significant economic benefits.

Description

technical field [0001] The invention relates to a forging method of high-quality 6061 aluminum alloy for semiconductor equipment, and belongs to the technical field of nonferrous metal forging processing. Background technique [0002] As a mature aluminum alloy grade, 6061 aluminum alloy is widely used in architectural decoration, transportation, aerospace and other fields due to its high strength, good corrosion resistance and processing performance. In the late 1990s, foreign countries began to apply high-quality 6061 aluminum alloys (referring to 6061 aluminum alloys that eliminate metallurgical defects, fine grains, and uniform structures after pressure processing) to key parts of semiconductor equipment, and found that they have good application performance. performance. With the rapid development of my country's semiconductor equipment industry, the demand for high-quality 6061 aluminum alloys is growing rapidly, but domestic 6061 aluminum alloy forgings are difficult...

Claims

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Application Information

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IPC IPC(8): C22F1/04B21J5/00
Inventor 杜鹏闫晓东范荣辉沈健
Owner GRIMAT ENG INST CO LTD
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