Preparation method of high-quality 6061 aluminium alloy forging for semiconductor equipment

Abstract

A preparation method of a high-quality 6061 aluminium alloy forging for semiconductor equipment comprises the following steps of: (1) blank making by a common semicontinuous casting method; (2) homogenization heat treatment of 6061 aluminium alloy by two-stage homogenization technology, wherein a first-stage temperature range is 540-570 DEG C, heat preservation time is selected to be 12-24 hours, a second-stage temperature range is 570-620 DEG C, and heat preservation time is selected to be 18-24 hours; (3) forging technology, wherein a preheating temperature of a press chopping block is 300-350 DEG C, the maximal forging heating time is not more than 3 when multi-heating forging is employed, an upsetting forging ratio for each heating is controlled to be 4-6 when forging with 2-3 heating times is employed, the forging ratio is controlled to be 7-9 when forging with one heating time is employed, and the final forging temperature is controlled to be 320-360 DEG C; (4) solid solution aging technology, wherein a solid solution temperature is 520-540 DEG C, heat preservation time is on a basis of 45 min, the heat preservation time increases by 1 min when the thickness of the forging increases by 1 mm, an aging temperature is 160-180 DEG C, and heat preservation time is between 16-25 hours. The invention provides the preparation method of a high-quality 6061 aluminium alloy forging for semiconductor equipment, and the method has the advantages of strong operability, high yield, stable product performance, high product added value, and the like, is applicable to production for small-lot supply, and has significant economic benefits.

Description

technical field [0001] The invention relates to a forging method of high-quality 6061 aluminum alloy for semiconductor equipment, and belongs to the technical field of nonferrous metal forging processing. Background technique [0002] As a mature aluminum alloy grade, 6061 aluminum alloy is widely used in architectural decoration, transportation, aerospace and other fields due to its high strength, good corrosion resistance and processing performance. In the late 1990s, foreign countries began to apply high-quality 6061 aluminum alloys (referring to 6061 aluminum alloys that eliminate metallurgical defects, fine grains, and uniform structures after pressure processing) to key parts of semiconductor equipment, and found that they have good application performance. performance. With the rapid development of my country's semiconductor equipment industry, the demand for high-quality 6061 aluminum alloys is growing rapidly, but domestic 6061 aluminum alloy forgings are difficult...

AI Technical Summary

Problems solved by technology

With the rapid development of my country's semiconductor equipment industry, the demand for high-quality 6061 aluminum alloys is growing rapidly, but domestic 6061 aluminum alloy forgings are difficult to meet the use requirements. The quality of the rear film layer is poor, and it is easy to cause large-area corrosion and scrap in the harsh working environment of semiconductor equipment

Since domestic aluminum alloy forgings are mainly used for load-bearing structural parts, the conventional forging process only achieves the purpose of eliminating metallurgical defects and forming, and the requirements for the structure and uniformity of the grain size of the alloy are not strict, so it is difficult to meet Requirements for the use of semiconductor devices

[0003] A search of existing technical literature found that there have been relevant reports on the preparation method of Al-Mg-Si alloy forgings, and no patents related to the forging process of high-quality 6061 aluminum alloys for semiconductor equipment have yet been published.

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