Packaging device and packaging method

Abstract

The invention provides a packaging device which comprises a stage, a radiation source and a fluid source. The stage is used for bearing a packaging structure for assembly, wherein the packaging structure is provided with a first substrate, a second substrate, and a molten material which is arranged between the first substrate and the second substrate to form at least one cavity; the radiation source is used for heating the molten material so that the molten material combines with the connecting surface of the first substrate and the second substrate and the cavity forms a hermetic packaging structure; and the fluid source provides a fluid beam, wherein the fluid beam acts on the first substrate and is used for pressing the a molten material between the first substrate and the second substrate.

Description

technical field [0001] The invention relates to the field of manufacturing technology of flat panel displays, in particular to a controllable injection fluid compaction system and a method for completing laser glass frit packaging by using the system. Background technique [0002] Flat Panel Display (FPD) has developed rapidly since the 1990s, and gradually matures, and is widely used in household appliances, computers and communication products. There are two types of flat panel displays: active light emitting and passive light emitting. The former refers to display devices that display the medium itself to emit light and provide visible radiation, including plasma display (PDP), vacuum fluorescent display (VFD), field emission display (FED), electroluminescent display (LED) and organic light-emitting diode display (OLED) Wait. The latter means that it does not emit light itself, but uses the optical characteristics of the display medium to change after being modulated by...

AI Technical Summary

Problems solved by technology

However, in the current encapsulation process of OLED laser glass powder, as pointed out in US2010 / 0118912, there may be some defects when coating glass paste on the encapsulation cover glass substrate, such as bumps, voids and thickness differences, which may cause Final Product Package Failure

Due to the existence of these defects, the yield of laser packaging is low

Therefore, US2010 / 0130091 proposes to compress the upper and lower glass substrates by vacuum pressing and sealing the glass body, so that the glass frit can be as close as possible to the glass substrate and reduce the impact of the gap. The compression effect, especially when the packaging glass is pre-packaged as described in US2007 / 0267972; while US2009 / 0233514 proposes to use mechanical compression to keep the glass frit as close as possible to the glass substrate and reduce the impact of the gap, but it needs Move the corresponding mechanical pressing device before laser scanning, increasing the operation time, and the pressing force is inconvenient to adjust

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