Method for constructing microelectrode pair array on surface of silicon chip containing hydrophobic silicon column

A silicon wafer surface and hydrophobic technology, applied in the field of constructing micro-electrode pair arrays and nanowires, can solve the problems of unsatisfactory assembly effects, etc., and achieve the effects of easy control, stable properties, and simple equipment

Inactive Publication Date: 2012-10-17
INST OF CHEM CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This type of method overcomes the shortcoming that it takes a long time to prepare the array of microelectrode pairs, but the effect of assembly is not ideal, and there are often defects and localized defects due to surface adhesion.

Method used

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  • Method for constructing microelectrode pair array on surface of silicon chip containing hydrophobic silicon column

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0033] (1) the silicon chip that adopts laser etching to go out the surface to contain hydrophilic silicon pillar array (the distance between two adjacent silicon pillars in the array and silicon pillar is 15 microns, and the diameter of silicon pillar is micron order standard) soaked in an ethanol solution containing octaalkylfluorosilane with a mass concentration of 1%, and the silicon wafer and octaalkylfluorosilane molecules were grafted for 12 hours, and the octaalkylfluorosilane molecules were modified to On the surface of the silicon chip, obtain a silicon chip containing a hydrophobic silicon column array (the diameter of the silicon column in the array is a micron scale);

[0034] (2) Utilize the effect of gravity to drive the aqueous solution doped with copper nanoparticles with a mass concentration of 1% polyvinyl alcohol and a particle diameter of 10 nm (the mass ratio of polyvinyl alcohol and copper nanoparticles is 1:5) with a speed of 5 cm / s. ) flows through the...

Embodiment 2

[0038] (1) The silicon wafer (the distance between two adjacent silicon pillars in the array and the silicon pillars in the array is 1 micron, the surface of which is prepared by the method of mask plate plus exposure) contains a hydrophilic silicon pillar array, and the silicon pillar The diameter is micron-scale scale) soaked in the acetone solution that contains the dedecyl fluorosilane that mass concentration is 13%, make described silicon chip and dedecyl fluorosilane molecule carry out grafting reaction 1 hour; Decadecyl fluoride Silane molecules are modified to the surface of the silicon chip to obtain a silicon chip containing a hydrophobic silicon column array (the diameter of the silicon column in the array is micron scale);

[0039] (2) Utilizing the adhesion induction technique, use ordinary small cotton swabs to adhere to the concentration of 1×10 -9 The aqueous solution of 3 of % poly 3,4-ethylenedioxythiophene, flows through the top surface of the hydrophobic si...

Embodiment 3

[0041] (1) the silicon chip (two adjacent silicon pillars in the array and the spacing between the silicon pillars in the array is 30 microns, and the diameter of the silicon pillar is Micron scale) soaked into the dimethyl sulfoxide solution containing dodecyl fluorosilane with a mass concentration of 25%, making the silicon chip and dodecyl fluorosilane molecule carry out grafting reaction for 24 hours, the ten Dialkylfluorosilane molecules are completely modified to the surface of the silicon wafer to obtain a silicon wafer containing a hydrophobic array of silicon pillars (the diameter of the silicon pillars in the array is on a micron scale);

[0042] (2) Utilize the action of a magnetic field to drive an aqueous solution containing 20% ​​polystyrene sulfonate-poly 3,4-ethylenedioxythiophene (PSS-PEDOT) at a speed of 1 cm / s to flow at a uniform velocity The top surface of the hydrophobic silicon pillar array on the silicon wafer obtained through step (1), along with the e...

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Abstract

The invention belongs to the electronic circuit field, and relates to large area and orientationally arranged nanowires formed on a surface of a silicon chip containing hydrophobic silicon columns, and relates to a method for constructing a microelectrode pair array. According to the invention, a method for grafting silicon fluoride on the surface of the silicon chip containing the hydrophilic silicon column array is employed, thereby the contact angle of the hydrophilic silicon column array and water is increased from 10 DEG to more than 150 DEG to obtain the silicon chip containing the hydrophobic silicon column array. An aqueous solution containing a substance for forming the nanowires is driven for flowing through the surface of the hydrophobic silicon columns with a uniform speed, thereby the orientationally arranged nanowires with diameter of nano scale formed on the top of two adjacent silicon columns in the hydrophobic silicon column array can be formed with large area and rapidity, and the nanowires are connected to two silicon columns to form the microelectrode pairs; thereby several microelectrode pairs form the microelectrode pair array. The method of the invention can adjust the thickness, length and spatial arrangement mode of the nanowires.

Description

technical field [0001] The invention belongs to the field of electronic circuits, and in particular relates to a method for forming a large-area oriented array of nanowires on the surface of a silicon wafer containing hydrophobic silicon pillars, thereby constructing a micro-electrode pair array. Background technique [0002] A microelectrode refers to an electrode whose one-dimensional size is in the order of microns (1×10 -6 m) to nanometer (1×10 -9 m) class of electrodes. When the one-dimensional size of the electrode is reduced from the millimeter level to the micron level, it exhibits many excellent electrochemical properties. For example, the microelectrode is not only beneficial to the in vivo analysis because of the small size of the electrode, but more importantly, it has incomparable properties of conventional electrodes. The advantages, that is, extremely high steady-state current density, extremely short response time, small polarization current, small ohmic vo...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B81C1/00
Inventor 江雷苏彬王树涛马杰宋延林
Owner INST OF CHEM CHINESE ACAD OF SCI
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