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Dustproof pellicle film, manufacturing method thereof, and dustproof pellicle component with pellicle film attached

A dust-proof film assembly and dust-proof film technology, which are applied in the photomechanical process of photomechanical processing, pattern surface photoengraving process, optics, etc., to achieve a small reduction in film thickness, maintain exposure quality for a long time, and improve light resistance. Effect

Inactive Publication Date: 2012-10-17
SHIN ETSU CHEM IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, before the problem occurs, the method of replacing the dustproof film has to be adopted.

Method used

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  • Dustproof pellicle film, manufacturing method thereof, and dustproof pellicle component with pellicle film attached
  • Dustproof pellicle film, manufacturing method thereof, and dustproof pellicle component with pellicle film attached
  • Dustproof pellicle film, manufacturing method thereof, and dustproof pellicle component with pellicle film attached

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0075] Such as Figure 4 The pellicle frame 41 made of A5052 aluminum alloy of the shape shown was produced by machining. The shape of the pellicle frame 41 is that the outer dimension of each corner is 1146 x 1392mm, the inner dimension is a rectangle of 1124 x 1370mm, and the thickness is 5.8mm. The shape of each corner is R2 inside and R6 outside. In addition, on the long side, four concave holes 43 with a diameter of 2.5 mm and a depth of 2 mm are provided for processing, and grooves 42 with a height of 2 mm and a depth of 3 mm are provided at two places on each of the short side and the long side. Further, on both long sides, 8 vent holes 46 with a diameter of 1.5 mm are provided.

[0076] The pellicle frame was transported into a class 10 clean room, washed well with a surfactant and pure water, and dried. Then, one end face of the pellicle frame is provided with a silicone adhesive layer as the pellicle adhesive layer 45, and the other end face is used as the photomas...

Embodiment 2

[0083] Same as Example 1, the outer dimension is 280×280, the inner dimension is 270×270, and the A5052 aluminum alloy dust-proof film assembly frame with a height of 4.8mm is made, and is carried out with surfactant and pure water in a clean room of class 10. Rinse well and dry completely. Thereafter, on one end face, a silicone adhesive (trade name: X-40-3004A, manufactured by Shin-Etsu Chemical Co., Ltd.) layer as an adhesive layer attached to a photomask was provided, and on the other end face, a As an adhesive for bonding the dustproof film, a silicone adhesive (trade name: KR3700, manufactured by Shin-Etsu Chemical Co., Ltd.) was applied and cured by heating in an oven. Then, a release sheet obtained by coating a 150-μm-thick PET film with fluorine-modified silicone was cut into a frame shape having almost the same outer dimension as the frame, and attached to the above-mentioned adhesive layer.

[0084] Then, on a quartz substrate of 350 x 350 x thickness 8 mm, which h...

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Abstract

The invention provides a dustproof pellicle film suitable for photoetching engineering with irradiation of ultraviolet rays in the wavelength field of 350-450nm comprising i ray, h ray, and g ray, and advantaged by cheapness and good light resistance. The pellicle film is the dustproof pellicle film for a dustproof pellicle film component used in the photoetching engineering with irradiation of ultraviolet rays in the wavelength field of 350-450nm. The dustproof pellicle film is characterized in that, for the surface on at least an exposure light source side of a raw material dustproof pellicle film, the average transmittance of the ultraviolet rays in the wavelength field of 350-450nm is more than 90%, and an ultraviolet ray absorption layer is provided, and the average transmittance of the ultraviolet rays in the wavelength field of 200-300nm with respect to the ultraviolet ray absorption layer is less than 50%.

Description

technical field [0001] The present invention relates to a pellicle used as a dustproof material in the manufacture of semiconductor devices, IC packages, printed substrates, liquid crystal displays, organic EL displays, etc., and particularly relates to the use of i-line (365nm) and h-line ( 405nm) or g-line (436nm), or a pellicle used in ultraviolet photolithography combined with them, a manufacturing method thereof, and a pellicle assembly for stretching the film. Background technique [0002] In the manufacture of semiconductors such as LSI and super LSI, IC packages, circuit boards such as printed circuit boards, liquid crystal displays, and organic EL displays, photoresists are placed on the surface of semiconductor wafers, packaging substrates, or original boards for displays, and then, by having The patterned photomask is developed by shining light on it to create the pattern. If there is dust on the photomask or reticle (hereinafter referred to as photomask) used at...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F1/48G03F1/46
CPCG03F1/22G03F1/38G03F1/62G03F1/64G03F7/70916
Inventor 関原一敏
Owner SHIN ETSU CHEM IND CO LTD
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