Novel LED (Light Emitting Diode) packaging piece based on DFN (Double Flat No-lead package) and QFN (Quad Flat No-lead Package), and manufacturing method of packaging piece

A technology for an LED package and a manufacturing method, which is applied to electrical components, electric solid-state devices, semiconductor devices, etc., can solve the problems of large product size, damage and deformation of solder joints, and limited application, so as to improve package reliability and reduce product size. Size, the effect of expanding the scope of application

Inactive Publication Date: 2012-10-17
HUATIAN TECH XIAN
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the working principle of LED lamps makes the heat dissipation problem very prominent in the high-power LED lighting industry. Many LED lighting solutions do not pay enough attention to heat dissipation, or the technical level is limited, so the actual service life of mass-produced high-power LED lamps is generally limited. It is far inferior to the theoretical value, and

Method used

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  • Novel LED (Light Emitting Diode) packaging piece based on DFN (Double Flat No-lead package) and QFN (Quad Flat No-lead Package), and manufacturing method of packaging piece
  • Novel LED (Light Emitting Diode) packaging piece based on DFN (Double Flat No-lead package) and QFN (Quad Flat No-lead Package), and manufacturing method of packaging piece
  • Novel LED (Light Emitting Diode) packaging piece based on DFN (Double Flat No-lead package) and QFN (Quad Flat No-lead Package), and manufacturing method of packaging piece

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027] A method for making a novel LED package based on DFN and QFN is carried out according to the following steps:

[0028] The first step, wafer thinning; wafer thinning thickness is 50μm, roughness Ra 0.10um;

[0029] The second step is to use a double-knife scribing machine and its process for scribing;

[0030] The third step is to use adhesive film to glue the core;

[0031] The fourth step is to use the conventional AAQFN process for pressure welding;

[0032] The fifth step is to use traditional plastic sealing compound 9220 for plastic sealing;

[0033] The sixth step is to use the conventional AAQFN process for post-curing, grinding, tinning, printing, product separation, inspection, packaging, and storage.

Embodiment 2

[0035] A method for making a novel LED package based on DFN and QFN is carried out according to the following steps:

[0036] The first step, wafer thinning; wafer thinning thickness is 130μm, roughness Ra 0.20um;

[0037] The second step is to use a double-knife scribing machine and its process for scribing;

[0038] The third step is to use the film (DAF) on the core;

[0039] The fourth step is to use the conventional AAQFN process for pressure welding;

[0040] The fifth step is to use traditional plastic sealing compound 9220 for plastic sealing;

[0041] The sixth step is to use the conventional AAQFN process for post-curing, grinding, tinning, printing, product separation, inspection, packaging, and storage.

Embodiment 3

[0043] A method for making a novel LED package based on DFN and QFN is carried out according to the following steps:

[0044] The first step, wafer thinning; wafer thinning thickness is 160μm, roughness Ra 0.30um;

[0045] The second step is to use the ordinary QFN scribing process;

[0046] The third step is to use the film (DAF) on the core;

[0047] The fourth step is to use the conventional AAQFN process for pressure welding;

[0048] The fifth step is to use traditional plastic sealing compound 9220 for plastic sealing;

[0049] The sixth step is to use the conventional AAQFN process for post-curing, grinding, tinning, printing, product separation, inspection, packaging, and storage.

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Abstract

The invention relates to a novel LED (Light Emitting Diode) packaging piece based on DFN (Double Flat No-lead package) and QFN (Quad Flat No-lead Package), and a manufacturing method of the packaging piece, belonging to the technical field of automatic electronic information components. The packaging piece comprises a lead frame carrier, a glue chip, an IC (Integrated Circuit) chip, a bonding line and a plastic packaging body, wherein the glue chip is fixed on the lead frame carrier; the IC chip is fixed on the glue chip; the PAD bonding line of the IC chip is connected with the lead frame carrier so as to form a current and signal channel of a circuit; and the plastic packaging body surrounds the lead frame carrier, the glue chip, the IC chip, the PAD on the IC chip and the bonding line connected with the lead frame carrier so as to form the overall circuit. The size of a product can be reduced effectively; and the packaging piece belongs to the high density packaging that the carrier is exposed, so that the cost is reduced, the application range of the product is expanded, and the packaging reliability is improved.

Description

technical field [0001] The invention relates to a novel LED package based on DFN and QFN and a manufacturing method thereof, and belongs to the technical field of electronic information automation component manufacturing. Background technique [0002] DFN is the latest electronic packaging process. It adopts advanced bilateral flat lead-free packaging (DFN). The DFN platform is the latest in surface mount packaging technology. The mounting pad, solder mask, and stencil pattern design of the printed circuit board (PCB), as well as the assembly process, all need to follow the corresponding principles. The DFN platform has the versatility to allow one or more semiconductor devices to be connected in a lead-free package. [0003] QFN (Quad Flat No-lead Package) is an emerging surface-mount chip packaging technology with small pad size, small volume, and plastic as the sealing material. The QFN has excellent electrical and thermal performance due to the large exposed pad at th...

Claims

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Application Information

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IPC IPC(8): H01L33/48H01L33/54
CPCH01L2224/32245H01L2224/48091H01L2224/48247H01L2224/73265H01L2224/92247H01L2924/181H01L2924/00014H01L2924/00012H01L2924/00
Inventor 郭小伟崔梦刘建军
Owner HUATIAN TECH XIAN
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