Frame sealing adhesive, preparation method thereof, and preparation method of liquid crystal display panel

Abstract

The invention discloses a frame sealing adhesive, a preparation method thereof, and a preparation method of a liquid crystal display panel. The frame sealing adhesive mainly comprises epoxy resin, acrylic ester, glass fiber and a metal conducting sphere, and also comprises a microwave absorbent. In addition, the preparation and use method of the frame sealing adhesive comprises the following steps of: selecting the microwave absorbent, adding the selected microwave absorbent in proportion into the existing frame sealing adhesive, and uniformly mixing; coating the frame sealing adhesive mixed with the microwave absorbent on an edge of an array substrate or a color film substrate; and carrying out box pairing and solidification in microwave generating equipment to form the liquid crystal display panel. Therefore, the time for solidification can be reduced, the frame sealing adhesive can be solidified uniformly, and the solidification degree is improved.

Description

technical field [0001] The invention relates to a production process of a liquid crystal display, in particular to a frame sealing glue, a preparation method thereof, and a preparation method of a liquid crystal panel. Background technique [0002] In the manufacturing process of thin-film transistor-liquid crystal display (TFT-LCD), it is necessary to combine the array substrate (TFT) and the color filter substrate (CF, Color Filter) and pour liquid crystal into it. This process is called "box matching process". Among them, the frame sealant plays the role of bonding the array substrate and the color filter substrate, forming a sealed container between the two substrates, and protecting the liquid crystal from the influence of the outside air. [0003] figure 1 It is a schematic cross-sectional structure diagram of an existing liquid crystal panel, such as figure 1 As shown, the liquid crystal panel includes: a common electrode 1, a black matrix 2, a color film resin 3, a...

AI Technical Summary

Problems solved by technology

[0006] 1) Due to the slow curing speed of epoxy resin, the thermal curing time of the frame sealant is long and the energy consumption is relatively large, which greatly affects the production efficiency and increases the production cost

[0007] 2) The frame sealant is cured by heat from the outside to the inside. Since the epoxy resin itself is a poor conductor of heat and the heat transfer speed is slow, the thermal conductivity of the frame sealant is poor, which makes the curing speed of the inside and outside of the frame sealant different, and the temperature from the outside to the inside The gradient is large, resulting in a low degree of curing and uneven curing, which in turn leads to the occurrence of defects such as poor peripheral thickness (Gap Mura)

[0008] 3) Due to the long curing time and incomplete curing of the currently used sealant, the pollutants produced by the sealant are likely to contaminate the liquid crystal, resulting in afterimages and other defects that affect the quality of the liquid crystal display

Therefore, it is easy to cause local overheating during curing, and the curing speed is too fast, while other parts are not completely cured, or even not cured, the degree of curing is reduced, internal stress is generated, and the overall performance is reduced.

Images