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Electrolytic bath for primary electroplating molding for upper plating layer and lower plating layer of crystallizer copper plate

A technology of crystallizer copper plate and electrolytic cell, applied in the direction of plating tank, etc., can solve the problems of easy cracking, peeling, easy formation of hard damage area, complicated procedures, etc. Procedurally simple effects

Active Publication Date: 2014-11-05
XIXIA LONGCHENG SPECIAL MATERIALS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The procedure is complicated and the time is long, and the bonding surface of the coating obtained by partitioning has two structures, which is easy to form flawed areas, cracks and peeling off

Method used

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  • Electrolytic bath for primary electroplating molding for upper plating layer and lower plating layer of crystallizer copper plate
  • Electrolytic bath for primary electroplating molding for upper plating layer and lower plating layer of crystallizer copper plate
  • Electrolytic bath for primary electroplating molding for upper plating layer and lower plating layer of crystallizer copper plate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0014] Such as figure 1 , image 3 Shown: a kind of crystallizer copper plate upper and lower plated one-time electroplating forming electrolyzer, comprises electrolyzer body 1 and is arranged on the cathode 2 and the anode 3 in the electrolyzer body 1, isolating film 4 is set in the electrolyzer body 1, described The isolation film 4 isolates the electrolytic cell body 1 into two areas, namely area 5 and area 6. The outer edge 4 of the isolation film is connected to the inner wall of the electrolytic cell body 1, and the inner edge is attached to the surface of the copper plate of the crystallizer. The isolation film 4 is a flexible plastic film, and the inner and outer edges of the flexible plastic film are provided with support bars 8. The support bars 8 can keep the isolation film 4 and the crystallizer copper plate surface isolation program at a relatively high level, limiting More electrolyte mixing occurs. By injecting the high-temperature resistant plating solution a...

Embodiment 2

[0016] Such as figure 2 , image 3 Shown: a kind of crystallizer copper plate upper and lower plated one-time electroplating forming electrolyzer, comprises electrolyzer body 1 and is arranged on the cathode 2 and the anode 3 in the electrolyzer body 1, isolating film 4 is set in the electrolyzer body 1, described The isolation film 4 isolates the electrolytic cell body 1 into two areas, namely area 5 and area 6. The outer edge 4 of the isolation film is connected to the inner wall of the electrolytic cell body 1, and the inner edge is attached to the surface of the copper plate of the crystallizer. The isolation film 4 is a flexible plastic film, and the inner and outer edges of the flexible plastic film are provided with support bars 8 . The number of layers of the isolation film 4 is two layers, and an exchange stable zone 7 is formed between the two tank areas. The electrolyte composition of this exchange stable zone 7 belongs to the transition zone between the two, and ...

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Abstract

The invention discloses an electrolytic bath for primary electroplating molding for an upper plating layer and a lower plating layer of a crystallizer copper plate, wherein the electrolytic bath for primary electroplating molding for the upper plating layer and the lower plating layer of the crystallizer copper plate comprises an electrolytic bath body and the crystallizer copper plate and an anode which are arranged in the electrolytic bath body; the electrolytic bath body is internally provided with a separating film; the separating film separates the electrolytic bath body into two areas; an outer edge of the separating film is connected with the inner wall of the electrolytic bath body; and the inner edge of the separating film is fit with the surface of the crystallizer copper plate. According to the invention, through the additional arrangement of the separating film for the electrolytic bath, the electrolytic bath body is separated into two areas, the crystallizer copper plate can be convenient to be subjected to primary electroplating, thus different plating layers are respectively electroplated on an upper part and a lower part of the copper plate, the problem in electroplating all the working surfaces of the crystallizer copper plate by a unitary plating layer material in the prior art is solved, and the phenomena generated because the plating layer on the upper part of the surface of the crystallizer copper plate has great heat stress, and cracking, stripping and the like for a slag line part occur easily are prevented.

Description

technical field [0001] The invention belongs to the technical field of electrolytic tanks for electroplating, and in particular relates to an electrolytic tank formed by one-time electroplating of upper and lower coating layers on copper plates of crystallizers. Background technique [0002] In the continuous casting process, the upper part of the slab is in a molten state and the temperature is high. It is required that the thermal stress of the copper plate coating is small, the toughness is high, the hardness is low, and the thermal cracking resistance is high. The lower part of the slab has already solidified at a lower temperature. The friction of the copper plate is large, and the coating of the copper plate is required to have high hardness and wear resistance. However, we usually use the method of electroplating a single coating on the copper plate to prolong the service life of the copper plate, which often cannot solve the above problems at the same time, and ca...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C25D17/02C25D7/00
Inventor 朱书成黄国团徐文柱赵家亮
Owner XIXIA LONGCHENG SPECIAL MATERIALS CO LTD