Manganese-doped aluminosilicate oxynitride luminescent film, preparation method and organic electroluminescent devices thereof
A technology of silicon aluminum oxynitride and luminescent thin film, which is applied in the direction of electric solid devices, electrical components, semiconductor devices, etc., can solve the problems of rare electroluminescent materials, and achieve the effect of low cost and simple preparation
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[0032] Step S1, preparation of ceramic target material: select Al 2 o 3 , MnO 2 and Si 3 N 4 The powder, after uniform mixing, is sintered in a muffle furnace at 900-1300°C (preferably 1250°C), cooled naturally at room temperature to obtain a target sample, and cut the target sample into a target with a size of Φ50×2mm ; Among them, Al 2 o 3 Accounting for 0.05-5% (mass percentage) of the total amount, MnO 2 Accounting for 0.01-1.5% (mass percentage) of the total amount, the balance is Si 3 N 4 ;
[0033] Step S2, put the target and substrate in step S1 into the vacuum chamber of the magnetron sputtering coating equipment, and use a mechanical pump and a molecular pump to pump the vacuum of the chamber to 1.0×10 -3 Pa~1.0×10 -5 Pa, preferably 5.0×10 -4 Pa;
[0034] Step S3, adjusting the magnetron sputtering coating process parameters as follows: the base-target distance is 45-95mm, preferably 60mm; the substrate temperature is 250°C-750°C, preferably 600°C; argon ...
Embodiment 1
[0039] 1. Select Al with a purity of 99.99% 2 o 3 , MnO 2 and Si 3 N 4 powder (among them, Al 2 o 3 , MnO 2 and Si 3 N 4 The mass percentages are 2.8%, 0.45%, and 96.75%). After uniform mixing, they are sintered in a muffle furnace at 1250°C, cooled naturally at room temperature, and the target samples are obtained, and the target samples are cut into Φ50 ×2mm target material;
[0040] 2. Put the target into the vacuum chamber of the magnetron sputtering coating equipment;
[0041] 3. Clean the glass substrate ultrasonically with acetone, absolute ethanol and deionized water successively, and perform oxygen plasma treatment on it, and then put it into the vacuum chamber of the magnetron sputtering coating equipment; among them, the target and the glass substrate The base target distance is set to 60mm;
[0042] 4. Use a mechanical pump and a molecular pump to pump the vacuum of the vacuum chamber of the magnetron sputtering coating equipment to 5.0×10 -4 Pa;
[00...
Embodiment 2
[0046] 1. Select Al with a purity of 99.99% 2 o 3 , MnO 2 and Si 3 N 4 powder (among them, Al 2 o 3 , MnO 2 and Si 3 N 4 The mass percentages are 0.05%, 1.5%, 98.45%), after uniform mixing, sintering treatment in a muffle furnace at 900°C, natural cooling at room temperature, to obtain target samples, and cut target samples into Φ50 ×2mm target;
[0047] 2. Put the target into the vacuum chamber of the magnetron sputtering coating equipment;
[0048] 3. Clean the glass substrate ultrasonically with acetone, absolute ethanol and deionized water successively, and perform oxygen plasma treatment on it, and then put it into the vacuum chamber of the magnetron sputtering coating equipment; among them, the target and the glass substrate The base target distance is set to 45mm;
[0049] 4. Use a mechanical pump and a molecular pump to pump the vacuum of the vacuum chamber of the magnetron sputtering coating equipment to 1.0×10 -3 Pa;
[0050] 5. Adjust the process parame...
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